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PDF CMA-62 Data sheet ( Hoja de datos )

Número de pieza CMA-62
Descripción Monolithic Amplifier
Fabricantes Mini-Circuits 
Logotipo Mini-Circuits Logotipo



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No Preview Available ! CMA-62 Hoja de datos, Descripción, Manual

FMlatoGanin,oHligihthIP3ic Amplifier
500.01 to 6 GHz
CMA-62+
The Big Deal
• Ceramic, Hermetically Sealed, Nitrogen filled
• Low profile case, .045” high
• Ultra Flat Gain
• Broadband High Dynamic Range without
external Matching Components
CASE STYLE: DL1721
Product Overview
CMA-62+ (RoHS compliant) is a wideband amplifier fabricated using HBT technology and offers ultra flat
gain over a broad frequency range and with high IP3. In addition, the CMA-62+, has good input and output
return loss over a broad frequency range without the need for external matching components and has dem-
onstrated excellent reliability. The MMIC amplifier is bonded to a multilayer integrated LTCC substrate, and
then hermetically sealed under a controlled nitrogen atmosphere with gold-plated covers and eutectic AuSn
solder. These amplifiers have been tested to MIL requirements for gross leak, fine leak, thermal shock,
vibration, acceleration, mechanical shock, and HTOL.
Key Features
Feature
Broad Band: 0.01 to 6.0 GHz
Advantages
Broadband covering primary wireless communications bands:
Cellular, PCS, LTE, WiMAX, SATELLITE IF
Ultra Flat Gain
±0.6 dB over 50 to 3000 MHz; ±0.10 dB over 700 to 2700 MHz
eliminates need for gain flattening for most applications
High IP3 vs. DC power Consumption
39 dBm typical at 0.05 GHz
37 dBm typical at 0.8 GHz
The CMA-62+ matches industry leading IP3 performance relative to device size and
power consumption. The combination of the design and HBT Structure provides en-
hanced linearity over a broad frequency range as evidence in the IP3 being typically 20
dB above the P 1dB point to 0.8 GHz. This feature makes this amplifier ideal for use in:
• Driver amplifiers for complex waveform up converter paths
• Drivers in linearized transmit systems
No External Matching Components
Required
Ceramic Hermetic Package
CMA-62+ provides Input and Output Return Loss of 10-23 dB up to 7 GHz without the need
for any external matching components
Low Inductance, repeatable performance, excellent reliability.
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
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CMA-62 pdf
Monolithic InGap HBT MMIC Amplifier
CMA-62+
Additional Detailed Technical Information
additional information is available on our dash board. To access this information click here
Performance Data
Case Style
Tape & Reel
Standard quantities available on reel
Data Table
Swept Graphs
S-Parameter (S2P Files) Data Set (.zip file)
DL1721 Ceramic package, exposed paddle, Terminal finish: Ni,Pd,Au
F66-1
7” reels with 20, 50, 100, 200, 500 or 1K, 2K devices.
Suggested Layout for PCB Design
Evaluation Board
Environmental Ratings
PL-366
TB-656-62+
ENV-68
ESD Rating
Human Body Model (HBM): Class 1C (1000 to <2000V) in accordance with ANSI/ESD STM 5.1 - 2001
Machine Model (MM): Class M2 (100 to <200V) in accordance with ANSI/ESD STM5.2-1999
MSL Rating
Moisture Sensitivity: MSL1 (these parts are hermetic, air cavity and therefore, MSL ratings do not strictly
apply. For handling purpose, use MSL1)
Qualification Testing
Test Description
Hermeticity (fine and gross leak)
Acceleration, 30Kg, Y1 Direction
Vibration , 10-2000Hz sine, 20g, 3 axis
Mechanical shock
PIND 20G’s @130 Hz
Temp Cycle -55C/+125C, 1000 Cycles
Autoclave, 121C, RH 100%, 15 Psig, 96 hrs
HTOL, 1000hrs, 105C at rated Voltage condition
Bend Test
Resistance to soldering heat, 3x reflow, 260C peak
Drop Test
Adhesion Strength
Test Method/Process
MIL-STD-202 Method 112, Cond. C & D
MIL-STD-883 Method 2001 Cond. E
MIL-STD-202 Method 204, Cond. D
MIL-STD-202 Method 213, Cond . A
MIL-STD-750 Method 2052.2
MIL-STD-202 Method 107
JESD22-A102C
MIL-STD-202 Method 108, Cond . D
JESD22-B113
JESD22-B102
JESD22-B111
Push Test>10 lb
Results
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Pass
Additional Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended
to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s
applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms
Notes and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits
A.
B.
C.
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“Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 [email protected]
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