(PDF) PLCCE-068-S1-TT Datasheet - Chip Carrier Socket

Número de pieza	PLCCE-068-S1-TT
Descripción	Chip Carrier Socket
Fabricantes	3M
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No Preview Available ! 3M Chip Carrier Socket 4-Row, Thru-hole PLCCE Series S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with IR reflow and wave soldering S Open frame allows visual inspection of solder joints Date Modified:March 10, 2003 Physical Insulation Material: Glass Filled PPS Flammability: UL 94V-0 Color: Black, Brown Contact Material: Phosphor Bronze Plating Underplating: 50 µ″, [ 1.3 µm ] Nickel Wiping Area: 100 µ″, [ 2.5 µm ] Tin/Lead Solder Tail Area: 200 µ″, [ 5.1 µm ] Tin/Lead Electrical Contact Resistance: 20 mΩ Insulation Resistance: 103 MΩ min. at 500 VDC Capacitance: 1 pF Environmental Temperature Rating: --55°C to +105°C TS-1156-01 Sheet 1 of 3 UL File No.: E68080 3 Interconnect Solutions http://www.3M.com/interconnects/ 3M is a trademark of 3M Company. For technical, sales or ordering information call 434 800-225-5373 1 page

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PDF PLCCE-068-S1-TT Data sheet ( Hoja de datos )