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PDF HMC8038 Data sheet ( Hoja de datos )
| Número de pieza | HMC8038 | |
| Descripción | Nonreflective Switch | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Data Sheet
High Isolation, Silicon SPDT,
Nonreflective Switch, 0.1 GHz to 6.0 GHz
HMC8038
FEATURES
Nonreflective, 50 Ω design
High isolation: 60 dB typical
Low insertion loss: 0.8 dB typical
High power handling
34 dBm through path
29 dBm terminated path
High linearity
0.1 dB compression (P0.1dB): 35 dBm typical
Input third-order intercept (IP3): 60 dBm typical
ESD ratings
4 kV human body model (HBM), Class 3A
1.25 kV charged device model (CDM)
Single positive supply
3.3 V to 5 V
1.8 V-compatible control
All off state control
16-lead, 4 mm × 4 mm LFCSP (16 mm2)
Pin compatible with the HMC849ALP4CE
APPLICATIONS
Cellular/4G infrastructure
Wireless infrastructure
Automotive telematics
Mobile radios
Test equipment
FUNCTIONAL BLOCK DIAGRAM
VDD 1
VCTL 2
RFC 3
NC 4
HMC8038
50Ω
50Ω
Figure 1.
12 RF2
11 GND
10 GND
9 RF1
PACKAGE
BASE
GENERAL DESCRIPTION
The HMC8038 is a high isolation, nonreflective, 0.1 GHz to
6.0 GHz, silicon, single-pole, double-throw (SPDT) switch in a
leadless, surface-mount package. The switch is ideal for cellular
infrastructure applications, yielding up to 62 dB of isolation up to
4.0 GHz, a low 0.8 dB of insertion loss up to 4.0 GHz, and 60 dBm
of input third-order intercept. Power handling is excellent up to
6.0 GHz, and it offers an input power for an 0.1 dB compression
point (P0.1dB) of 35 dBm (VDD = 5 V). On-chip circuitry operates
a single, positive supply voltage from 3.3 V to 5 V, as well as a
single, positive voltage control from 0 V to 1.8 V/3.3 V/5.0 V at
very low dc currents. An enable input (EN) set to logic high
places the switch in an all off state, in which RFC is reflective.
The HMC8038 has ESD protection on all device pins, including
the RF interface, and can stand 4 kV HMB and 1.25 kV CDM.
The HMC8038 offers very fast switching and RF settling times of
150 ns and 170 ns, respectively. The device comes in a RoHS-
compliant, compact 4 mm × 4 mm LFCSP.
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2015 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Bias Voltage Range (VDD)
Control Voltage Range (VCTL, EN)
RF Input Power1 (see Figure 2)
Through Path
Terminated Path
Hot Switching
Channel Temperature
Storage Temperature Range
Thermal Resistance (Channel to Package
Bottom)
Through Path
Terminated Path
ESD Sensitivity
HBM
CDM
Rating
−0.3 V to +5.5 V
−0.5 V to VDD + (+0.5 V)
35 dBm
30 dBm
30 dBm
135°C
−65°C to +150°C
110°C/W
100°C/W
4 kV (Class 3A)
1.25 kV
1 For recommended operating conditions, see Table 1.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
HMC8038
During the through mode of operation, the supply voltage scales
the maximum allowed input power. The power handling vs.
frequency for the 3.3 V and 5 V supplies is shown in Figure 2.
40
35
30
25
AMR
OPERATING 5V
OPERATING 3.3V
20
012345
FREQUENCY (GHz)
Figure 2. Through Path, Power Handling vs. Frequency
ESD CAUTION
6
Rev. A | Page 5 of 11
5 Page 
Data Sheet
OUTLINE DIMENSIONS
HMC8038
PIN 1
INDICATOR
1.00
0.90
0.80
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.65
BSC
0.70
0.60
0.50
0.39
0.33
0.27
13
12
16
1
EXPOSED
PAD
9
4
85
BOTTOM VIEW
1.95 REF
PIN 1
INDICATOR
(0.30)
2.55
2.40 SQ
2.25
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
Figure 19. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.90 mm Package Height
(CP-16-40)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
HMC8038LP4CE −40°C to +105°C
HMC8038LP4CETR −40°C to +105°C
EV1HMC8038LP4C −40°C to +105°C
MSL Rating2
MSL3
MSL3
Package Description
16-lead Lead Frame Chip Scale Package [LFCSP]
16-lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Package Option
CP-16-40
CP-16-40
Branding3
8038
XXXX
8038
XXXX
1 RoHs-Compliant Part.
2 The maximum peak reflow temperature is 260°C.
3 4-digit lot number: XXXX.
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13554-0-11/15(A)
Rev. A | Page 11 of 11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet HMC8038.PDF ] | |
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