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PDF TCS230 Data sheet ( Hoja de datos )
| Número de pieza | TCS230 | |
| Descripción | COLOR LIGHT-TO-FREQUENCY CONVERTER | |
| Fabricantes | TAOS | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TCS230 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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r TCS230
PROGRAMMABLE
r COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046Q − JULY 2008
D High-Resolution Conversion of Light
Intensity to Frequency
D Programmable Color and Full-Scale Output
Frequency
D Communicates Directly With a Microcontroller
D Single-Supply Operation (2.7 V to 5.5 V)
D Power Down Feature
D Nonlinearity Error Typically 0.2% at 50 kHz
D Stable 200 ppm/°C Temperature Coefficient
D Low-Profile Lead (Pb) Free and RoHS
Compliant Surface-Mount Package
S0 1
S1 2
OE 3
GND 4
PACKAGE D
8-LEAD SOIC
(TOP VIEW)
8 S3
7 S2
6 OUT
5 VDD
Description
The TCS230 programmable color light-to-frequency converter combines configurable silicon photodiodes and
a current-to-frequency converter on a single monolithic CMOS integrated circuit. The output is a square wave
(50% duty cycle) with frequency directly proportional to light intensity (irradiance). The full-scale output
frequency can be scaled by one of three preset values via two control input pins. Digital inputs and digital output
allow direct interface to a microcontroller or other logic circuitry. Output enable (OE) places the output in the
high-impedance state for multiple-unit sharing of a microcontroller input line.
The light-to-frequency converter reads an 8 x 8 array of photodiodes. Sixteen photodiodes have blue filters, 16
photodiodes have green filters, 16 photodiodes have red filters, and 16 photodiodes are clear with no filters.
The four types (colors) of photodiodes are interdigitated to minimize the effect of non-uniformity of incident
irradiance. All 16 photodiodes of the same color are connected in parallel and which type of photodiode the
device uses during operation is pin-selectable. Photodiodes are 120 μm x 120 μm in size and are on 144-μm
centers.
Functional Block Diagram
Light
Photodiode
Array
Current-to-Frequency
Converter
Output
S2 S3
S0 S1
OE
The LUMENOLOGY r Company
r
Texas Advanced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972r) 673-0759
www.taosinc.com
Copyright E 2008, TAOS Inc.
1
1 page  
TCS230
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046Q − JULY 2008
TYPICAL CHARACTERISTICS
PHOTODIODE SPECTRAL RESPONSIVITY
1
0.9
Clear
0.8
0.7
Green
0.6
Blue
0.5
0.4
0.3
Normalized to
Clear
@ 715 nm
Red TA = 25°C
Blue
0.2
0.1
0
300
Green
500 700 900
λ − Wavelength − nm
1100
Figure 1
PHOTODIODE SPECTRAL RESPONSIVITY WITH
EXTERNAL IR-BLOCKING FILTER†
1
0.9
Clear
Normalized to
Clear
@ 540 nm
0.8
0.7
Blue
0.6
Green
TA = 25°C
0.5
0.4
Red
0.3
0.2
0.1
0
300 500 700 900 1100
λ − Wavelength − nm
† Typical IR filter examples include Schott BG18, Schott BG39, and
Hoya CM500.
Figure 2
NORMALIZED OUTPUT FREQUENCY
vs.
ANGULAR DISPLACEMENT
1
0.8
0.6
0.4
0.2
0
−90
Angular Displacement is
Equal for Both Aspects
−60 −30 0 30 60
Q − Angular Displacement − °
Figure 3
90
PHOTODIODE RESPONSIVITY TEMPERATURE
COEFFICIENT vs.
WAVELENGTH OF INCIDENT LIGHT
11k
10k
9k
8k
7k
6k
5k
4k
3k
2k
1k
0
600 650 700 750 800 850 900 950 1000
λ − Wavelength of Incident Light − nm
Figure 4
The LUMENOLOGY r Company
r
www.taosinc.com
r
Copyright E 2008, TAOS Inc.
5
5 Page 
TCS230
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046Q − JULY 2008
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To prevent
these adverse conditions, all devices shipped in carrier tape have been pre-baked and shipped in a sealed
moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within
24 hours of the seal being broken on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
The LUMENOLOGY r Company
r
www.taosinc.com
r
Copyright E 2008, TAOS Inc.
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet TCS230.PDF ] | |
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