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PDF RT9610C Data sheet ( Hoja de datos )
| Número de pieza | RT9610C | |
| Descripción | High Voltage Synchronous Rectified Buck MOSFET Driver | |
| Fabricantes | Richtek | |
| Logotipo |  |
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®
RT9610C
High Voltage Synchronous Rectified Buck MOSFET Driver
for Notebook Computer
General Description
The RT9610C is a high frequency, dual MOSFET driver
specifically designed to drive two power N-MOSFETS in
a synchronous-rectified buck converter topology. It is
especially suited for mobile computing applications that
require high efficiency and excellent thermal performance.
This driver, combined with Richtek's series of multi-phase
Buck PWM controllers, provides a complete core voltage
regulator solution for advanced microprocessors.
The drivers are capable of driving a 3nF load with fast
rising/falling time and fast propagation delay. This device
implements bootstrapping on the upper gates with only a
single external capacitor. This reduces implementation
complexity and allows the use of higher performance, cost
effective, N-MOSFETs. Adaptive shoot through protection
is integrated to prevent both MOSFETs from conducting
simultaneously.
The RT9610C is available in WDFN-8L 2x2 Package.
Marking Information
2QW
2Q : Product Code
W : Date Code
Features
Drives Two N-MOSFETs
Adaptive Shoot-Through Protection
0.5Ω On-Resistance, 4A Sink Current Capability
Supports High Switching Frequency
Tri-State PWM Input for Power Stage Shutdown
Output Disable Function
Integrated Boost Switch
Low Bias Supply Current
VCC POR Feature Integrated
Applications
Core Voltage Supplies for Intel® / AMD® Mobile
Microprocessors
High Frequency Low Profile DC/DC Converters
High Current Low Output Voltage DC/DC Converters
High Input Voltage DC/DC Converters
Ordering Information
RT9610C
Package Type
QW : WDFN-8L 2x2 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Simplified Application Circuit
VCC
Enable
PWM
RT9610C
VCC UGATE
BOOT
PHASE
EN
PWM LGATE
GND
VIN
VCORE
Copyright ©2015 Richtek Technology Corporation. All rights reserved.
DS9610C-00 February 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
1 page  
RT9610C
Parameter
Symbol
Test Conditions
Min Typ Max Unit
PWM Input
Input Current
IPWM
VPWM = 5V
VPWM = 0V
-- 174 --
-- 174 --
A
PWM Tri-State Rising Threshold
VPWMH
VCC = 5V
3.5 3.8 4.1
V
PWM Tri-State Falling Threshold
EN Input
VPWML
VCC = 5V
0.7 1 1.3 V
EN Input Voltage
Switching Time
Logic-High
Logic-Low
VENH
VENL
VCC = 5V
VCC = 5V
2 -- --
V
-- -- 0.48
UGATE Rise Time
tUGATEr
VCC = 5V, 3nF Load
-- 8 -- ns
UGATE Fall Time
tUGATEf
VCC = 5V, 3nF Load
-- 8 -- ns
LGATE Rise Time
tLGATEr
VCC = 5V, 3nF Load
-- 8 -- ns
LGATE Fall Time
tLGATEf
VCC = 5V, 3nF Load
-- 4 -- ns
UGATE Turn-Off Propagation Delay tPDLU
VCC = 5V, Outputs Unloaded -- 35 -- ns
LGATE Turn-Off Propagation Delay tPDLL
VCC = 5V, Outputs Unloaded -- 35 -- ns
UGATE Turn-On Propagation Delay tPDHU
VCC = 5V, Outputs Unloaded -- 20 -- ns
LGATE Turn-On Propagation Delay
UGATE/LGATE Tri-State
Propagation Delay
tPDHL
tPTS
VCC = 5V, Outputs Unloaded -- 20 -- ns
VCC = 5V, Outputs Unloaded -- 35 -- ns
Output
UGATE Driver Source Resistance RUGATEsr 100mA Source Current
-- 1 --
UGATE Driver Source Current
UGATE Driver Sink Resistance
UGATE Driver Sink Current
IUGATEsr
RUGATEsk
IUGATEsk
VUGATE VPHASE = 2.5V
100mA Sink Current
VUGATE VPHASE = 2.5V
-- 2 -- A
-- 1 --
-- 2 -- A
LGATE Driver Source Resistance RLGATEsr 100mA Source Current
-- 1 --
LGATE Driver Source Current
LGATE Driver Sink Resistance
LGATE Driver Sink Current
ILGATEsr
RLGATEsk
ILGATEsk
VLGATE = 2.5V
100mA Sink Current
VLGATE = 2.5V
-- 2 --
-- 0.5 --
-- 4 --
A
A
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended. The human body mode is a 100pF capacitor is
charged through a 1.5kΩ resistor into each pin.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright ©2015 Richtek Technology Corporation. All rights reserved.
DS9610C-00 February 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
5 Page 
RT9610C
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
Layout Considerations
Figure 4 shows the schematic circuit of a synchronous
buck converter to implement the RT9610C.
L1
VIN
12V
C1
VCORE
C3
Q1
L2
Q2
C2 1
CB BOOT VCC 5
RT9610C
8 UGATE
7 PHASE
PHB83N03LT
2
PWM
6
EN
PHB95N03LT 4 LGATE GND 3
5V
R1
C4
PWM
5V
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-8L 2x2 packages, the thermal resistance, θJA, is
45.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by the following formula :
PD(MAX) = (125°C − 25°C) / (45.5°C/W) = 2.19W for
WDFN-8L 2x2 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance, θJA. The derating curves in Figure 3 allow the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
2.5
Four-Layer PCB
Figure 4. Synchronous Buck Converter Circuit
When layout the PCB, it should be very careful. The power
circuit section is the most critical one. If not configured
properly, it will generate a large amount of EMI. The
junction of Q1, Q2, L2 should be very close.
Next, the trace from UGATE, and LGATE should also be
short to decrease the noise of the driver output signals.
PHASE signals from the junction of the power MOSFET,
carrying the large gate drive current pulses, should be as
heavy as the gate drive trace. The bypass capacitor C4
should be connected to GND directly. Furthermore, the
bootstrap capacitors (CB) should always be placed as close
to the pins of the IC as possible.
2.0
1.5
1.0
0.5
0.0
0
25 50 75 100
Ambient Temperature (°C)
125
Figure 3. Derating Curve of Maximum Power Dissipation
Copyright ©2015 Richtek Technology Corporation. All rights reserved.
DS9610C-00 February 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet RT9610C.PDF ] | |
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