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PDF RT9611A Data sheet ( Hoja de datos )
| Número de pieza | RT9611A | |
| Descripción | Synchronous Rectified Buck MOSFET Drivers | |
| Fabricantes | Richtek | |
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®
RT9611A/B
Synchronous Rectified Buck MOSFET Drivers
General Description
The RT9611A/B is a high frequency, synchronous rectified,
single phase dual MOSFET driver designed to adapt from
normal MOSFET driving applications to high performance
CPU VR driving capabilities.
The RT9611A/B can be utilized under both VCC = 5V or
VCC = 12V applications. The RT9611A/B also builds in an
internal power switch to replace external boot strap diode.
The RT9611A/B can support switching frequency efficiently
up to 500kHz. The RT9611A/B has the UGATE driving
circuit and the LGATE driving circuit for synchronous
rectified DC/DC converter applications. The driving rise/
fall time capability is designed within 30ns and the shoot
through protection mechanism is designed to prevent shoot
through of high side and low side power MOSFETs. The
RT9611A/B has PWM tri-state shut down and OD input
shut down functions which can force driver output into
high impedance.
The difference of the RT9611A and the RT9611B is the
propagation delay, tUGATEpdh. The RT9611B has
comparatively large tUGATEpdh than RT9611B. Hence, the
RT9611A is usually recommended to be utilized in
performance oriented applications, such as high power
density CPU VR or GPU VR.
The RT9611A/B comes in a small footprint with 8-pin
packages. The choice of packages type includes SOP-8,
SOP-8 (Exposed Pad) and WDFN-8EL 3x3.
Features
z Drive Two N-MOSFETs
z Adaptive Shoot Through Protection
z Embedded Bootstrap Diode
z Support High Switching Frequency
z Fast Output Rise Time
z Tri-State Input for Bridge Shutdown
z Disable Control Input
z Small SOP-8, SOP-8 (Exposed Pad) and 8-Lead
WDFN Packages
z RoHS Compliant and Halogen Free
Applications
z Core Voltage Supplies for Desktop, Motherboard CPU
z High Frequency Low Profile DC/DC Converters
z High Current Low Voltage DC/DC Converters
Ordering Information
RT9611A/B
Package Type
S : SOP-8
SP : SOP-8 (Exposed Pad-Option1)
QW : WDFN-8EL 3x3 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Z : ECO (Ecological Element with
Halogen Free and Pb free)
Long Dead Time
Short Dead Time
Note :
Richtek products are :
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
` Suitable for use in SnPb or Pb-free soldering processes.
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9611A/B-03 June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
1 page  
RT9611A/B
Absolute Maximum Ratings (Note 1)
z Supply Voltage, VCC ---------------------------------------------------------------------------------- −0.3V to 15V
z BOOT to PHASE --------------------------------------------------------------------------------------- −0.3V to 15V
z PHASE to GND
DC ---------------------------------------------------------------------------------------------------------- −5V to 15V
< 200ns --------------------------------------------------------------------------------------------------- −10V to 30V
z LGATE
DC ---------------------------------------------------------------------------------------------------------- (GND − 0.3V) to (VCC + 0.3V)
< 200ns --------------------------------------------------------------------------------------------------- −2V to (VCC + 0.3V)
z UGATE ---------------------------------------------------------------------------------------------------- (VPHASE − 0.3V) to (VBOOT + 0.3V)
< 200ns --------------------------------------------------------------------------------------------------- (VPHASE − 2V) to (VBOOT + 0.3V)
z PWM Input Voltage ------------------------------------------------------------------------------------ (GND − 0.3V) to 7V
z OD --------------------------------------------------------------------------------------------------------- (GND − 0.3V) to 7V
z Power Dissipation, PD @ TA = 25°C
SOP-8 ----------------------------------------------------------------------------------------------------- 0.833W
SOP-8 (Exposed Pad) -------------------------------------------------------------------------------- 1.333W
WDFN-8EL 3x3 ----------------------------------------------------------------------------------------- 1.429W
z Package Thermal Resistance (Note 2)
SOP-8, θJA ----------------------------------------------------------------------------------------------- 120°C/W
SOP-8 (Exposed Pad), θJA --------------------------------------------------------------------------- 75°C/W
SOP-8 (Exposed Pad), θJC -------------------------------------------------------------------------- 15°C/W
WDFN-8EL 3x3, θJA ------------------------------------------------------------------------------------ 70°C/W
WDFN-8EL 3x3, θJC ----------------------------------------------------------------------------------- 8.2°C/W
z Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------ 260°C
z Junction Temperature ---------------------------------------------------------------------------------- 150°C
z Storage Temperature Range ------------------------------------------------------------------------- −65°C to 150°C
z ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)
z Supply Voltage, VCC ---------------------------------------------------------------------------------- 12V ±10%
z Junction Temperature Range ------------------------------------------------------------------------- −40°C to 125°C
z Ambient Temperature Range ------------------------------------------------------------------------- −40°C to 85°C
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9611A/B-03 June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
5 Page 
RT9611A/B
capacitance CB has to be selected properly. It is
determined by following constraints.
VIN
BOOT
Figure 4 shows the power dissipation of the RT9611A/B
as a function of frequency and load capacitance. The value
of CU and CL are the same and the frequency is varied
from 100kHz to 1MHz.
UGATE
PHASE
VCC
CB +
VCB
-
Power Dissipation vs. Frequency
1000
900
800 CU = CL = 3nF
LGATE
700
GND
600
CU = CL = 2nF
500
Figure 2. Part of Bootstrap Circuit of RT9611A/B
In practice, a low value capacitor CB will lead to the over
charging that could damage the IC. Therefore, to minimize
400
300
200
100
CU = CL = 1nF
the risk of overcharging and to reduce the ripple on VCB,
the bootstrap capacitor should not be smaller than 0.1μF,
and the larger the better. In general design, using 1μF can
provide better performance. At least one low ESR capacitor
0
0 200 400 600 800
Frequency (kHz)
Figure 4. Power Dissipation vs. Frequency
1000
should be used to provide good local de-coupling. It is
recommended to adopt a ceramic or tantalum capacitor.
The operating junction temperature can be calculated from
the power dissipation curves (Figure 4). Assume
Power Dissipation
To prevent driving the IC beyond the maximum
recommended operating junction temperature of 125°C,
it is necessary to calculate the power dissipation
appropriately. This dissipation is a function of switching
frequency and total gate charge of the selected MOSFET.
Figure 3 shows the power dissipation test circuit. CL and
CU are the UGATE and LGATE load capacitors,
respectively. The bootstrap capacitor value is 1μF.
10
12V
CBOOT
1µF
12V
1µF
5V
PWM
BOOT
VCC UGATE
RT9611A/B
PHASE
OD
PWM LGATE
GND
2N7002
CU
3nF
2N7002
CL
3nF
20
VCC = 12V, operating frequency is 200kHz and
CU = CL = 1nF which emulate the input capacitances of
the high side and low side power MOSFETs. From Figure
4, the power dissipation is 100mΩ. Thus, for example,
with the SOP-8 package thermal resistance θJA is 120°C/
W. The operating junction temperature is calculated as :
TJ = (120°C/W x 100mW) + 25°C = 37°C
(11)
where the ambient temperature is 25°C.
Thermal Considerations
For recommended operating condition specifications of
the RT9611A/B, the maximum junction temperature is
125°C and TA is the ambient temperature. The junction to
ambient thermal resistance, θJA, is layout dependent. For
SOP-8 packages, the thermal resistance, θJA, is 120°C/
W on a standard JEDEC 51-7 four-layer thermal test board.
For SOP-8 (Exposed Pad) packages, the thermal
resistance, θJA, is 75°C/W on a standard JEDEC 51-7
four-layer thermal test board. For WDFN-8EL 3x3
Figure 3. Test Circuit
packages, the thermal resistance, θJA, is 70°C/W on a
standard JEDEC 51-7 four-layer thermal test board. The
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
DS9611A/B-03 June 2012
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet RT9611A.PDF ] | |
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