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PDF EClamp2456P Data sheet ( Hoja de datos )

Número de pieza EClamp2456P
Descripción ESD/EMI Protection
Fabricantes Semtech 
Logotipo Semtech Logotipo



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No Preview Available ! EClamp2456P Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2456P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 28nH and a capacitor value of 12pF
are used to achieve 40dB minimum attenuation at
800MHz. The TVS diodes provide effective suppression
of ESD voltages in excess of ±15kV (air discharge) and
±8kV (contact discharge) per IEC 61000-4-2, level 4.
The EClamp2456P is in a 12-pin, RoHS/WEEE compli-
ant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
Circuit Diagram (Each Line)
Features
EClamp2456P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 40dB minimum attenuation at
800MHz to 2.7GHz
‹ TVS working voltage: 5V
‹ Inductor: 28nH (Typical)
‹ Capacitance: 12pF (Typical at VR = 2.5V)
‹ Protection and filtering for six lines
‹ Solid-state technology
Mechanical Characteristics
‹ SLP3016P12 12-pin package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
‹ Lead Pitch: 0.5mm
‹ Lead finish: NiPd
‹ Marking: Marking Code
‹ Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Package Configuration
L1 L2
IN
C1 C2
C3
OUT
GND
3.00
12
1.60
0.50 BSC
0.58
Device Schematic (6X)
Revision 03/29/2006
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com

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EClamp2456P pdf
EClamp2456P
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration.
Figure 3 - Recommended Layout Using Ground Vias
PRELIMINARY
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
-54 dB
1
MHz
START. 030 MHz
10
MHz
1: -5.3134 dB
156 MHz
2: -41.559 dB
800 MHz
1
3: -41.327 dB
1.8 GHz
4: -40.105 dB
2.7 GHz
4
23
100
MHz
13
GHz GHz
STOP 3000.000000 MHz
2006 Semtech Corp.
5
www.semtech.com

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