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PDF EClamp2506K Data sheet ( Hoja de datos )
| Número de pieza | EClamp2506K | |
| Descripción | ESD/EMI Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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PROTECTION PRODUCTS - EMIClamp®
Description
The EClamp® 2506K device is a low pass filter array
with integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a 3-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 17nH and a capacitor value of 12pF
are used to achieve 20dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC
61000-4-2, level 4.
The EClamp2506K is in a 12-pin, SLP2513P12 pack-
age. It measures 2.5 x 1.3 x 0.50mm. The leads are
spaced at a pitch of 0.4mm and are finished with lead-
free NiPdAu. The small package makes it ideal for use
in portable electronics such as cell phones, digital still
cameras, and PDAs.
Features
EClamp2506K
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 20dB minimum attenuation
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 17nH (Typical)
Capacitors: 12pF (Typical at VR = 2.5V)
Protection and filtering for six lines
Solid-state technology
Mechanical Characteristics
SLP2513P12 12-pin package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 2.5 x 1.3 x 0.50mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking : Marking Code and Date Code
Packaging : Tape and Reel
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
17nH
IN
12pF 12pF
OUT
GND
2.50
12
1.30
0.40 BSC
0.50
Device Schematic (6X)
Revision 4/14/2010
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
1 page  
EClamp2506K
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 is highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configura-
tion.
Figure 3 - Recommended Layout Using Ground Vias
PRELIMINARY
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
START . 030 MHz
10
MHz
1: -4. 46 dB
250 MHz
2: -26.206 dB
800 MHz
3: -34.349 dB
1 1.8 GHz
4: -33.371 dB
2.7 GHz
2
34
100
MHz
13
GHz GHz
STOP 3000. 000000 MHz
© 2010 Semtech Corp.
5
www.semtech.com
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| PDF Descargar | [ Datasheet EClamp2506K.PDF ] | |
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