SI1101 Datasheet PDF - SEPUNA
| Part Number | SI1101 | |
| Description | One Component High Thermal Conductive Grease | |
| Manufacturers | SEPUNA | |
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SI1101
Technical Data Sheet
One Component High Thermal Conductive Grease
SI1101
◆Detailed Product Description
Features
1. SI1101 is produced by imported raw material and formula, composed by organo-siloxane and metallic
oxide which with good thermal conductivity and insulativity. So the grease has fabulous thermal
conductivity and insulativity.
2. It has high stability from -50℃ to +200℃
3. The viscosity is low and it’s easy to application.
4. Non-poisonous, no corrosion, no smell, won’t dry and solute
5. High Thermal conductivity, 1.5W/(m·K)
6. Low Bleed, ≤2.0% in 8 hours and 200℃
7. Good temperature resistance, no harden and flowing in 200℃
Usage
Widely used as thermal transmission medium among electronic components, such as the shimming of CPU
and radiator, gap filling of triac semiconductor diode and basic material(aluminum or copper etc.) for
reducing the work temperature of heater element.
Model number
Appearance
Penetration(1/100mm)
Density（g/cm3）
Bleed（%,200℃/8hr）
Volatility （%,200℃/8hr）
Thermal Conductivity（W/m.K）
◆Data Table
SI 1101
White Paste
300
2.2
≤ 3. 0
≤ 2.2
1.5
Note：
①All data above were tested
under standardized condition.
②All data listed in the chart were
for the generalized item in the
series; please refer to the related
data sheet for special items.
③Storage condition has a direct
impact to the products’ shelf life,
Please refer to the instruction for
special items’ storing.
Version 1.02 / 2014-05 /SEPUNA
SEPUNA CHEMICALS
Hotline:400-882-1323
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for SI1101 electronic component. |
| Information | Total 2 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ SI1101.PDF Datasheet ] | |
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| Part Number | Description | MFRS |
| SI1101 | The function is One Component High Thermal Conductive Grease. SEPUNA | |
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