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PDF MAAP-011140-DIE Data sheet ( Hoja de datos )
| Número de pieza | MAAP-011140-DIE | |
| Descripción | Power Amplifier | |
| Fabricantes | MA-COM | |
| Logotipo |  |
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MAAP-011140-DIE
Power Amplifier, 6 W
27.5 - 30.0 GHz
Features
High Gain: 24 dB
P1dB: 37.5 dBm
PSAT: 38.5 dBm
IM3 Level: -24 dBc @ POUT = 33 dBm/tone
Power Added Efficiency: 23% @ PSAT
Return Loss: 12 dB
Bare Die Dimensions: 3.6 x 3.8 x 0.05 mm
RoHS* Compliant
Description
The MAAP-011140-DIE is a 4-stage, 6 W power
amplifier in bare die form. This power amplifier
operates from 27.5 to 30.0 GHz and provides 24 dB
of linear gain, 6 W saturated output power, and 23%
efficiency while biased at 6 V.
The MAAP-011140-DIE is a power amplifier ideally
suited for VSAT communications.
This product is fabricated using a GaAs pHEMT
device process which features full passivation for
enhanced reliability.
Ordering Information
Part Number
MAAP-011140-DIE
1. Die quantity varies
Package
Die in Gel Pack1
Functional Diagram
345
Vd1 GND Vd2
67
Vd3 GND
8
Vd4
Rev. V2
2 GND
1 RFIN
18 GND
Backside Die
GND
GND 9
RFOUT 10
GND 11
Vg GND
17 16
GND
15
Vd3 GND Vd4
14 13
12
Pin Configuration2
Pad Function Description
1 RFIN RF Input
2, 4, 7, 9, 11,
13, 15, 16, 18
& backside
3
GND
VD1
Ground
Drain Voltage Stage 1
5 VD2 Drain Voltage Stage 2
6, 14
VD3 Drain Voltage Stage 3
8, 12
VD4 Drain Voltage Stage 4
10 RFOUT RF Output
17 VG Gate Voltage
2. Backside metal is RF, DC and thermal ground.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1 page  
MAAP-011140-DIE
Power Amplifier, 6 W
27.5 - 30.0 GHz
Application Information
The MAAP-011140 is designed to be easy to use yet
high performance. The ultra small size and simple
bias allows easy placement on system board. RF
input and output ports are DC de-coupled internally.
Biasing conditions
Recommended biasing conditions are VD = 6 V,
IDQ = 3000 mA (controlled with VG). The drain bias
voltage range, VD, is 3 to 6.5 V, and the quiescent
drain current biasing range, IDQ, is 2000 to 4000
mA.
VD bias must be applied to VD1, VD2, VD3, and VD4
pads.
Both VD3 pads (6 and 14) are required for current
symmetry.
Both VD4 pads (8 and 12), are required for current
symmetry.
A single DC voltage (VG) will bias all amplifier
stages. Muting can be accomplished by setting the
VG to the pinched off voltage (VG = -2 V).
Die Attachment
This product is manufactured from 0.050 mm
(0.002”) thick GaAs substrate and has vias through
to the backside to enable grounding to the circuit.
Recommended conductive epoxy is Namics
Unimec XH9890-6. Epoxy should be applied and
cured in accordance with the manufacturer’s
specifications and should avoid contact with the top
of the die.
Rev. V2
Operating the MAAP-011140-DIE
Turn-on
1. Apply VG (-1.5 V).
2. Apply VD (6.0 V typical).
3. Set IDQ by adjusting VG more positive
(typically VG~ -0.9 V for IDQ = 3000 mA).
4. Apply RFIN signal.
Turn-off
1. Remove RFIN signal.
2. Decrease VG to -1.5 V.
3. Decrease VD to 0 V.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these devices.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5 Page 
MAAP-011140-DIE
Power Amplifier, 6 W
27.5 - 30.0 GHz
MMIC Die Outline
Rev. V2
Bond Pad Detail
Pad
A, B, C
D, M
E, L, O
F
G, K
H, J, Q, S
I, R
N, P
Size (x)
88
169
161
84
249
89
89
158
Size (y)
88
88
88
84
88
99
159
88
Notes:
1. All units are in µm, unless otherwise noted, with
a tolerance of ±5 µm.
2. Die thickness is 50 ±10 µm.
11
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MAAP-011140-DIE.PDF ] | |
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