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PDF ALN0070 Data sheet ( Hoja de datos )
| Número de pieza | ALN0070 | |
| Descripción | Internally Matched LNA Module | |
| Fabricantes | ASB | |
| Logotipo |  |
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plerowTM ALN0070
Internally Matched LNA Module
Features
· S21 = 35.8 dB@65 MHz
= 36.2 dB@75 MHz
· NF of 0.9 dB over Frequency
· Unconditionally Stable
· Single 5 V Supply
· High OIP3@Low Current
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ.@T = 25 C, Vs = 5 V, Freq. = 70 MHz, Zo.sys = 50 ohms
Parameter
Specifications
Unit
Min Typ Max
Frequency Range
MHz
65
75
Gain
dB 35 36
Gain Flatness
dB
0.2 0.3
Noise Figure
dB
0.9 0.95
Output IP3
dBm 36 37
S11/S22
dB
-18/-18
Output P1dB
dBm 19 20
Switching Time (3)
sec
-
Supply Current
mA
150 170
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 23~25 (before fail)
Package Type & Size
mm Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 4 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [email protected]
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
plerow
ALN0070
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø 0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
October 2014
1 page | ||
| Páginas | Total 3 Páginas | |
| PDF Descargar | [ Datasheet ALN0070.PDF ] | |
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