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Cypress Semiconductor - Serial Peripheral Interface

Numéro de référence S25FS256S
Description Serial Peripheral Interface
Fabricant Cypress Semiconductor 
Logo Cypress Semiconductor 





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S25FS256S fiche technique
S25FS128S
S25FS256S
1.8 V, Serial Peripheral Interface with
Multi-I/O, MirrorBit® Non-Volatile Flash
Features
Density
– S25FS128S-128 Mbits (16 Mbytes)
– S25FS256S-256 Mbits (32 Mbytes)
Serial Peripheral Interface (SPI)
– SPI Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Extended Addressing: 24- or 32-bit address options
– Serial Command subset and footprint compatible with S25FL-A,
S25FL-K, S25FL-P, and S25FL-S SPI families
– Multi I/O Command subset and footprint compatible with S25FL-P,
and S25FL-S SPI families
Read
– Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad I/O
– Modes: Burst Wrap, Continuous (XIP), QPI
– Serial Flash Discoverable Parameters (SFDP) and Common
Flash Interface (CFI), for configuration information
Program
– 256- or 512-byte Page Programming buffer
– Program suspend and resume
Erase
– Hybrid sector option
– Physical set of eight 4-kbyte sectors and one 32-kbyte sector at
the top or bottom of address space with all remaining sectors of 64
kbytes
– Uniform sector option
– Uniform 64-kbyte or 256-kbyte blocks for software compatibility
with higher density and future devices
– Erase suspend and resume
– Erase status evaluation
– 100,000 Program-Erase Cycles on any sector, minimum
– 20 Year Data Retention, typical
Security Features
– One-Time Program (OTP) array of 1024 bytes
– Block Protection:
– Status Register bits to control protection against program or erase
of a contiguous range of sectors
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or password
– Option for password control of read access
Technology
– Spansion 65 nm MirrorBit Technology with EclipseArchitecture
Supply Voltage
– 1.7V to 2.0V
Temperature Range
– Industrial (0°C to +85°C)
– Industrial Plus (–40°C to +105°C)
Packages (All Pb-Free)
– 8-lead SOIC 208 mil (SOC008) - FS128S only
– WSON 6x5 mm (WND008) - FS128S only
– WSON 6x8 mm (WNH008) - FS256S only
– 16-lead SOIC 300 mil (SO3016- FS256S only)
– BGA-24 6x8 mm
– 5x5 ball (FAB024) footprint
– 4x6 ball (FAC024) footprint
– Known Good Die, and Known Tested Die
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-00368 Rev. *G
• San Jose, CA 95134-1709 • 408-943-2600
Revised February 02, 2016

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