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Número de pieza | DSEP12-12BZ | |
Descripción | High Performance Fast Recovery Diode | |
Fabricantes | IXYS | |
Logotipo | ||
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No Preview Available ! HiPerFRED
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DSEP12-12BZ
1
3
4
DSEP12-12BZ
VRRM = 1200 V
I FAV
=
12 A
trr = 35 ns
Backside: cathode
Features / Advantages:
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Applications:
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
Package: TO-263 (D2Pak-HV)
● Industry standard outline
● RoHS compliant
● Epoxy meets UL 94V-0
Terms Conditions of usage:
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact the sales office, which is responsible for you.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you.
Should you intend to use the product in aviation, in health or live endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20131029a
1 page DSEP12-12BZ
Fast Diode
40
35
30
25
IF
20
[A] 15
TVJ = 25°C
100°C
150°C
10
5
0
0123
VF [V]
Fig. 1 Forward current
IF versus VF
0.4
T = 125°C
VJ
VR = 800 V
0.3
QR
0.2
[μC]
0.1
I = 30 A
F
15 A
7.5 A
60
T = 125°C
VJ
V = 800 V
R
50
40
IRM
30
[A]
20
10
I = 30 A
F
15 A
7.5 A
0.0 0
4
250 500 750 1000 1250 1500
250 500 750 1000 1250 1500
-diF /dt [A/ms]
Fig. 2 Typ. reverse recov. charge
Qr versus -diF /dt
-diF /dt [A/ms]
Fig. 3 Typ. peak reverse current
IRM versus -diF /dt
1.6
1.2
KF 0.8
IRM
500
IF = 30 A
400
15 A
trr 300 7.5 A
[ns]
200
T = 125°C
VJ
VR = 800 V
100
80
VFR 60
[V] 40
500
400
T = 125°C
VJ
I = 15 A
F
VR = 800 V
30tf0
[ns]
200
0.4
Qrr
100
20 V
FR
100
t
fr
0.0
0
40 80 120 160
TVJ [°C]
Fig. 4 Typ. dynamic parameters
Qr, IRM versus TVJ
0
250 500 750 1000 1250 1500
-diF /dt [A/ms]
Fig. 5 Typ. recovery time
trr versus -diF /dt
00
0 200 400 600 800 1000 1200
-diF /dt [A/ms]
Fig. 6 Typ. peak forward voltage
VFR and tfr versus diF /dt
2000
1600
T = 125°C
VJ
V = 800 V
R
1200
Erec
800
[μJ]
400
IF = 30 A
15 A
7.5 A
2.0
1.6
ZthJC
1.2
[K/W]
0.8
0.4
0
250 500 750 1000 1250 1500
-diF /dt [A/ms]
Fig. 7 Typ. recovery energy
Erec versus -diF /dt
0.0
1
10 100 1000
t [ms]
Fig. 8 Transient thermal resistance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
10000
20131029a
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet DSEP12-12BZ.PDF ] |
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