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2KBP02M fiches techniques PDF

MOSPEC - 2.0A GLASS PASSIVATED BRIDGE RECTIFIER

Numéro de référence 2KBP02M
Description 2.0A GLASS PASSIVATED BRIDGE RECTIFIER
Fabricant MOSPEC 
Logo MOSPEC 





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2KBP02M fiche technique
MOSPEC
2.0A GLASS PASSIVATED BRIDGE RECTIFIER
FEATURES
Glass Passivated Die Construction
Typical IR less than 0.1uA
High case dielectric strength
Ideal for printed circuit boards
High Surge Current Capability
High temperature soldering guaranteed:
260 /10 second at 5 lbs (2.3kg) tension.
MECHANICAL DATA
Case: Molded Plastic
Epoxy: UL94V-O rate flame retardant
Terminals Plated Leads Solderable
Per MIL-STD-750 Method 2026
Polarity As Marking on Body
Mounting Position: Any
Weight 1.7 gram (approx.)
Marking:Type Number
2KBP005M THRU 2KBP10M
KBP
Dim Min
Max
A 14.22 15.24
B 10.66 16.68
C 15.20
---
D 4.56 5.10
E 3.60 4.30
G 2.16 2.54
H 0.76 0.85
I 1.52
---
J 11.68 12.70
K 12.70
---
L 3.2×45O Typical
Unit :mm
MAXIMUM RATINGS AND ELECTRICAL CHARATERISTICS
* Rating at 25 ambient temperature unless otherwise specified
* Single phase,half wave. 60Hz, resistive or inductive load.
* For capacitive load derate current by 20 %
Characteristic
Symbol 2KBP 2KBP 2KBP 2KBP 2KBP 2KBP 2KBP
005M 01M 02M 04M 06M 08M 10M
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM 50 100 200 400 600 800 1000
VR
Unit
V
RMS Reverse Voltage
VR(RMS)
Average Rectifier Forward Current
(Note 1)
@ TA=55
Non-Repetitive Peak Surge Current
8.3 ms Single half sine-wave superimposed on
rated load ( JEDEC Method)
Forward Voltage (per element) ( IF =2.0 Amp)
Peak Reverse Current
( Rated DC Voltage, TC = 25 )
( Rated DC Voltage, TC = 100 )
Rating for Fusing( t<8.3 ms)
Typical Junction Capacitance per element (Note2)
IO(AV)
IFSM
VFM
IR
I2t
CJ
Typical Thermal Resistance (note 3)
Operating and Storage Temperature Range
Rθ jA
TJ , Tstg
35
70 140 280 420 560 700
2.0
60
1.1
V
A
A
V
5.0
500
15
25
30
-65 to +165
uA
A2s
pF
k/W
Note: 1 Lead maintained at ambient temperature at a distance of 9.5 mm from the case.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance junction to ambient, mounted on PC board with 12 mm2 copper pad.

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