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Número de pieza | ESDARF01-1BF4 | |
Descripción | ESD protection | |
Fabricantes | STMicroelectronics | |
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No Preview Available ! ESDARF01-1BF4
ESD protection for AM and FM antenna
Features
■ Single line bidirectional protection
■ Very low capacitance (1.2 pF max)
■ Lead-free package
■ Very low capacitance, line to ground, for
optimized data integrity
■ Low PCB space consumption: 0.18 mm2 max
■ No insertion loss in AM and FM band
■ High reliability offered by monolithic integration
Complies with the following standards
■ IEC 61000-4-2:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G- Method 3015-7: class 3B
Applications
Where transient over voltage protection in ESD
sensitive equipment is required, such as:
■ Portable audio systems
■ Communication systems
■ Cellular phone handsets and accessories
■ Audio and video equipment
Description
The ESDARF01-1BF4 is a monolithic application
specific device dedicated to ESD protection of the
AM and FM antenna in cell phones and portable
equipment.
The device is ideal for applications where both
reduced printed circuit board space and power
absorption capability are required.
Datasheet production data
0201 Flip Chip
Figure 1. Functional diagram
January 2013
This is information on a product in full production.
Doc ID 024162 Rev1
1/13
www.st.com
13
1 page ESDARF01-1BF4
2 Application schematics
Application schematics
Figure 9. Application schematics
When the reference of earpieces (audio amplifier) is different from 0 V
To reference
of earpieces
(audio amplifier)
100 nF
ESDARF01-1BF4
270 nH
To bottom
connector,
reference of the
earpieces and FM antenna
To FM RF input
of the FM module
FM
Receiver
When the reference of earpieces (audio amplifier) is 0 V
270 nH
To bottom
connector,
reference of the
earpieces and FM antenna
ESDARF01-1BF4
To FM RF input
of the FM module
FM
Receiver
Whatever the reference of earpieces (audio amplifier)
To reference
of earpieces
(audio amplifier)
100 nF
270 nH
To bottom
connector,
reference of the
earpieces and FM antenna
ESDARF01-1BF4
To FM RF input
of the FM module
FM
Receiver
Doc ID 024162 Rev1
5/13
5 Page ESDARF01-1BF4
Recommendation on PCB assembly
5.5
Note:
Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
250
200
150
100
0.9 °C/s
50
0 30 60 90
240-245 °C
2 - 3 °C/s
60 sec
(90 max)
-2 °C/s
-3 °C/s
-6 °C/s
Time (s)
120 150 180 210 240 270 300
Minimize air convection currents in the reflow oven to avoid component movement.
Doc ID 024162 Rev1
11/13
11 Page |
Páginas | Total 13 Páginas | |
PDF Descargar | [ Datasheet ESDARF01-1BF4.PDF ] |
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