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ISSI - 16Mx32 512Mb DDR2 DRAM

Numéro de référence IS43DR32160C
Description 16Mx32 512Mb DDR2 DRAM
Fabricant ISSI 
Logo ISSI 





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IS43DR32160C fiche technique
IS43/46DR32160C
16Mx32
512Mb DDR2 DRAM
FEATURES
Vdd = 1.8V ±0.1V, Vddq = 1.8V ±0.1V
JEDEC standard 1.8V I/O (SSTL_18-compatible)
Double data rate interface: two data transfers
per clock cycle
Differential data strobe (DQS, DQS)
4-bit prefetch architecture
On chip DLL to align DQ and DQS transitions
with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL) 3, 4, 5, and 6
supported
Posted CAS and programmable additive latency
(AL) 0, 1, 2, 3, 4, and 5 supported
WRITE latency = READ latency - 1 tCK
Programmable burst lengths: 4 or 8
Adjustable data-output drive strength, full and
reduced strength options
On-die termination (ODT)
OPTIONS
Configuration:
16M x 32 (IS43/46DR32160C - 8K refresh)
Package: x32: 126-ball WBGA
Timing – Cycle time
2.5ns @CL=6, DDR2-800E
3.0ns @CL=5, DDR2-667D
3.75ns @CL=4, DDR2-533C
5.0ns @CL=3, DDR2-400B
Temperature Range:
Commercial (0°C Tc 85°C; 0°C Ta 70°C)
Industrial (–40°C Tc 95°C; –40°C Ta 85°C)
Automotive, A1 (–40°C Tc 95°C; –40°C Ta 85°C)
Automotive, A2 (–40°C Tc 105°C; –40°C Ta 105°C)
Tc = Case Temp, Ta = Ambient Temp
NOVEMBER 2013
DESCRIPTION
ISSI's 512Mb DDR2 SDRAM uses a double-data-rate
architecture to achieve high-speed operation. The
double-data rate architecture is essentially a 4n-prefetch
architecture, with an interface designed to transfer two
data words per clock cycle at the I/O balls.
The 512Mb DDR2 SDRAM is provided in a wide bus
x32 format, designed to offer a smaller footprint and
support compact designs.
ADDRESS TABLE
Parameter
Configuration
Refresh Count
Row Addressing
Column
Addressing
Bank Addressing
Precharge
Addressing
16M x 32
4M x 32 x 4 banks
8K/64ms
A0-A12
A0-A8
BA0, BA1
A10/AP
KEY TIMING PARAMETERS
Speed Grade -25E -3D -37C
tRCD
15 15 15
tRP 15 15 15
tRC 60 60 60
tRAS
45 45 45
tCK @CL=3
555
tCK @CL=4
3.75 3.75 3.75
tCK @CL=5
3 3 3.75
tCK @CL=6
2.5 3 3.75
-5B
15
15
55
40
5
5
5
5
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. A
11/11/2013

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