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Comchip Technology - Surface Mount Switching Diode

Numéro de référence CDST7000
Description Surface Mount Switching Diode
Fabricant Comchip Technology 
Logo Comchip Technology 





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CDST7000 fiche technique
Surface Mount Switching Diode
CDST7000
Voltage: 100 Volts
Current: 200 mA
COMCHIP
www.comchiptech.com
Features
Fast Switching Speed
Surface Mount Package Ideally Suited for
Automatic Insertion
For General Purpose Switching Applications
High Conductance
.119 (3.0)
.110 (2.8)
.020 (0.5)
3
SOT-23
Top View
Mechanical data
Case: SOT-23, Plastic
Terminals: Solderable per MIL-STD-202,
Method 208
Approx. Weight: 0.008 gram
12
.037(0.95) .037(0.95)
1
ANODE
3
CATHODE/ANODE
2
CATHODE
.020 (0.5) .020 (0.5)
.103 (2.6)
.086 (2.2)
Dimensions in inches (millimeters)
Maximum Ratings
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
Rating
Thermal Characteristics
Characteristic
Total Device Dissipation FR– 5 Board(1)
Derate above 25°C
TA = 25°C
Thermal Resistance, Junction t o Ambient
Total Device Dissipation Alumina S ubstrate,(2) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction t o Ambient
Junction and Storage Temperature
Electrical Characterics (TA = 25°C unless otherwise noted)
Characteristic (OFF CHARACTERISTICS)
Reverse Breakdown Voltage ( I(BR) = 100 uAdc )
Reverse Voltage Leakage Current
VR = 50 Vdc
VR = 100 Vdc
VR = 50 Vdc, 125°C
Forward Voltage
IF = 1.0 mAdc
IF = 10 mAdc
IF = 100 mAdc
Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1)
Diode Capacitance (VR = 0)
1.FR–5 = 1.0 X 0.75X 0.062 in. 2.Alumina = 0.4X 0.3X 0.024 in. 99.5% alumina.
MDS0301004A
Symbol
VR
IF
IFM (surge)
Value
100
200
500
Units
VDC
mAdc
mAdc
Symbol
PD
RθJA
PD
RθJA
TJ, Tstg
Max
225
1.8
556
300
2.4
417
–55 to +150
Units
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
Symbol
V(BR)
IR
IR2
IR3
VF
Trr
C
Min
100
-
-
-
0.55
0.67
0.75
-
Max
-
1
3
100
0.7
0.82
1.1
4.0
1.5
Units
Vdc
uAdc
Vdc
nS
pF
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