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PDF M24C16-W Data sheet ( Hoja de datos )
| Número de pieza | M24C16-W | |
| Descripción | 16-Kbit serial I2C bus EEPROM | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de M24C16-W (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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TSSOP8 (DW)
169 mil width
SO8 (MN)
150 mil width
PDIP8 (BN)
UFDFPN8
(MC)
UFDFPN5
(MH)
M24C16-W M24C16-R
M24C16-F
16-Kbit serial I²C bus EEPROM
Datasheet - production data
Features
• Compatible with all I2C bus modes:
– 400 kHz
– 100 kHz
• Memory array:
– 16 Kbit (2 Kbyte) of EEPROM
– Page size: 16 byte
• Single supply voltage:
– M24C16-W: 2.5 V to 5.5 V
– M24C16-R: 1.8 V to 5.5 V
– M24C16-F: 1.7 V to 5.5 V (full temperature
range) and 1.6 V to1.7 V (limited
temperature range)
• Write:
– Byte Write within 5 ms
– Page Write within 5 ms
• Operating temperature range:
– from -40 °C up to +85 °C
• Random and sequential Read modes
• Write protect of the whole memory array
• Enhanced ESD/Latch-Up protection
• More than 4 million Write cycles
• More than 200-years data retention
Packages
• PDIP8 ECOPACK1®
• SO8 ECOPACK2®
• TSSOP8 ECOPACK2®
• UFDFPN8 ECOPACK2®
• UFDFPN5 ECOPACK2®
• Unsawn wafer (each die is tested)
Unsawn wafer
March 2016
This is information on a product in full production.
DocID023494 Rev 8
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1 page  
M24C16-W M24C16-R M24C16-F
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
UFDFPN5 package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Maximum Rbus value versus bus parasitic capacitance (Cbus) for
an I2C bus at maximum frequency fC = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch
dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch
dual flat package, no leadpackage outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 34
SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 36
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M24C16-W M24C16-R M24C16-F
4 Device operation
Device operation
The device supports the I2C protocol. This is summarized in Figure 5. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The device is always a slave in all
communications.
Figure 5. I2C bus protocol
3#,
3$!
34!24
#ONDITION
3$!
)NPUT
3$!
#HANGE
34/0
#ONDITION
3#,
3$!
-3"
34!24
#ONDITION
3#,
3$!
-3"
!#+
!#+
34/0
#ONDITION
!)"
DocID023494 Rev 8
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11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet M24C16-W.PDF ] | |
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