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PDF M48Z512AV Data sheet ( Hoja de datos )

Número de pieza M48Z512AV
Descripción 4 Mbit (512 Kbit x 8) ZEROPOWER SRAM
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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No Preview Available ! M48Z512AV Hoja de datos, Descripción, Manual

M48Z512A
M48Z512AY, M48Z512AV
4 Mbit (512 Kbit x 8) ZEROPOWER® SRAM
Not recommended for new design
Features
Integrated, ultra low power SRAM, power-fail
control circuit, and battery
Conventional SRAM operation; unlimited
)WRITE cycles
t(s10 years of data retention in the absence of
cpower
duAutomatic power-fail chip deselect and WRITE
roprotection
PTwo WRITE protect voltages:
te(VPFD = power-fail deselect voltage)
le– M48Z512A: VCC = 4.75 to 5.5 V;
4.5 V VPFD 4.75 V
so– M48Z512AY: VCC = 4.5 to 5.5 V;
b4.2 V VPFD 4.5 V
O– M48Z512AV: VCC = 3.0 to 3.6 V;
-2.8 V VPFD 3.0 V
t(s)Battery internally isolated until power is applied
cPin and function compatible with JEDEC
ustandard 512 K x 8 SRAMs
rodPMDIP32 is an ECOPACK® package
RoHS compliant
Obsolete P– Lead-free second level interconnect
32
1
PMDIP32 module
Description
The M48Z512A/Y/V ZEROPOWER® RAM is a
non-volatile, 4,194,304-bit static RAM organized
as 524,288 words by 8 bits. The devices combine
an internal lithium battery, a CMOS SRAM and a
control circuit in a plastic, 32-pin DIP module.
June 2011
Doc ID 5146 Rev 9
This is information on a product still in production but not recommended for new designs.
1/21
www.st.com
1

1 page




M48Z512AV pdf
M48Z512A, M48Z512AY, M48Z512AV
1 Device overview
Device overview
Figure 1. Logic diagram
VCC
19
A0-A18
8
DQ0-DQ7
M48Z512A
W M48Z512AY
)M48Z512AV
t(sE
cG
Obsolete Product(s) - Obsolete ProduTable 1.
Signal names
A0-A18
DQ0-DQ7
E
G
W
VCC
VSS
VSS
Address inputs
Data inputs/outputs
Chip enable input
Output enable input
WRITE enable input
Supply voltage
Ground
AI02043
Doc ID 5146 Rev 9
5/21

5 Page





M48Z512AV arduino
M48Z512A, M48Z512AY, M48Z512AV
Operating modes
Table 4. WRITE mode AC characteristics
Symbol
Parameter(1)
M48Z512A/Y
–70
Min Max
M48Z512A/Y/V
–85
Min Max
Unit
tAVAV WRITE cycle time
70 85 ns
tAVWL Address valid to WRITE enable low
0
0 ns
tAVEL Address valid to chip enable low
0
0 ns
tWLWH WRITE enable pulse width
55 65 ns
Obsolete Product(s) - Obsolete Product(s)2.3
tELEH Chip enable low to chip enable high
55
75 ns
tWHAX WRITE enable high to address transition
5
5 ns
tEHAX Chip enable high to address transition
15
15 ns
tDVWH Input valid to WRITE enable high
30
35 ns
tDVEH Input valid to chip enable high 30 35 ns
tWHDX WRITE enable high to input transition
0
0 ns
tEHDX Chip enable high to input transition
tWLQZ(2)(3) WRITE enable low to output Hi-Z
10 10 ns
25 30 ns
tAVWH Address valid to WRITE enable high
65
75 ns
tAVEH Address valid to chip enable high
tWHQX(2)(3) WRITE enable high to output transition
65
5
75 ns
5 ns
1. Valid for ambient operating temperature: TA = 0 to 70 °C or –40 to 85 °C; VCC = 4.75 to 5.5 V, 4.5 to 5.5 V
or 3.0 to 3.6 V (except where noted).
2. CL = 5 pF.
3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
Data retention mode
With valid VCC applied, the M48Z512A/Y/V operates as a conventional BYTEWIDE™ static
RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect,
WRITE protecting itself tWP after VCC falls below VPFD. All outputs become high impedance,
and all inputs are treated as “don't care.”
If power fail detection occurs during a valid access, the memory cycle continues to
completion. If the memory cycle fails to terminate within the time tWP, WRITE protection
takes place. When VCC drops below VSO, the control circuit switches power to the internal
energy source which preserves data.
The internal coin cell will maintain data in the M48Z512A/Y/V after the initial application of
VCC for an accumulated period of at least 10 years when VCC is less than VSO. As system
power returns and VCC rises above VSO, the battery is disconnected, and the power supply
is switched to external VCC. WRITE protection continues for tER after VCC reaches VPFD to
allow for processor stabilization. After tER, normal RAM operation can resume.
For more information on battery storage life refer to the application note AN1012.
Doc ID 5146 Rev 9
11/21

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