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PDF FSAM15SH60A Data sheet ( Hoja de datos )
| Número de pieza | FSAM15SH60A | |
| Descripción | Motion SPM2 module | |
| Fabricantes | Fairchild Semiconductor | |
| Logotipo |  |
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FSAM15SH60A
Motion SPM® 2 Series
Features
• UL Certified No. E209204 (UL1557)
• 600 V - 15 A 3-Phase IGBT Inverter with Integral
Gate Drivers and Protection
• Low-Loss, Short-Circuit Rated IGBTs
• Low Thermal Resistance Using Ceramic
Substrate
• Separate Open-Emitter Pins from Low Side IGBTs
for Three-Phase Current Sensing
• Single-Grounded Power Supply
• Optimized for 15 kHz Switching Frequency
• Built-in NTC Thermistor for Temperature
Monitoring
• Inverter Power Rating of 0.8 kW / 100~253 VAC
• Adjustable Current Protection Level via Selection
of Sense-IGBT Emitter's External Rs
• Isolation Rating: 2500 Vrms / min.
January 2014
General Description
FSAM15SH60A is a Motion SPM® 2 module
providing a fully-featured, high-performance inverter
stage for AC Induction, BLDC, and PMSM motors.
These modules integrate optimized gate drive of
the built-in IGBTs to minimize EMI and losses, while
also providing multiple on-module protection
features including under-voltage lockouts, over-
current shutdown, thermal monitoring, and fault
reporting. The built-in, high-speed HVIC requires
only a single supply voltage and translates the
incoming logic-level gate inputs to the high-voltage,
high-current drive signals required to properly drive
the module's internal IGBTs. Separate negative
IGBT terminals are available for each phase to
support the widest variety of control algorithms.
Applications
• Motion Control - Home Appliance / Industrial Motor
Resource
• AN-9043 - Motion SPM® 2 Series User's Guide
Figure 1. Package Overview
Package Marking and Ordering Information
Device
Device Marking
Package
FSAM15SH60A
FSAM15SH60A
S32AA-032
©2003 Fairchild Semiconductor Corporation
FSAM15SH60A Rev. C8
1
Packing Type
Rail
Quantity
8
www.fairchildsemi.com
1 page  
Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified.)
Inverter Part
Item
Supply Voltage
Supply Voltage (Surge)
Collector - Emitter Voltage
Each IGBT Collector Current
Each IGBT Collector Current
Each IGBT Collector Current (Peak)
Collector Dissipation
Operating Junction Temperature
Symbol
VDC
VPN(Surge)
VCES
± IC
± IC
± ICP
PC
TJ
Condition
Applied to DC-Link
Applied between P and N
TC = 25°C
TC = 100°C
TC = 25°C , Under 1ms Pulse Width
TC = 25°C per Chip
(2nd Note 1)
Rating
450
500
600
15
11
30
50
-20 ~ 125
Unit
V
V
V
A
A
A
W
°C
2nd Notes:
1. It would be recommended that the average junction temperature should be limited to TJ 125C (at TC 100C) in order to guarantee safe operation.
Control Part
Item
Symbol
Condition
Control Supply Voltage
VCC
Applied between VCC(UH), VCC(VH), VCC(WH) -
COM(H), VCC(L) - COM(L)
High-Side Control Bias Voltage VBS Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) -
VS(W)
Input Signal Voltage
VIN Applied between IN(UH), IN(VH), IN(WH) - COM(H)
IN(UL), IN(VL), IN(WL) - COM(L)
Fault Output Supply Voltage
VFO Applied between VFO - COM(L)
Fault Output Current
IFO Sink Current at VFO Pin
Current-Sensing Input Voltage VSC Applied between CSC - COM(L)
Rating
20
Unit
V
20 V
-0.3 ~ VCC+0.3 V
-0.3 ~ VCC+0.3
5
-0.3 ~ VCC+0.3
V
mA
V
Total System
Item
Self-Protection Supply Voltage Limit
(Short-Circuit Protection Capability)
Module Case Operation Temperature
Storage Temperature
Isolation Voltage
Symbol
Condition
VPN(PROT) Applied to DC-Link,
VCC = VBS = 13.5 ~ 16.5 V
TJ = 125°C, Non-Repetitive, < 6 s
TC See Figure 2
TSTG
VISO 60Hz, Sinusoidal, AC 1 Minute, Connect
Pins to Heat Sink Plate
Rating
400
Unit
V
-20 ~ 100
-20 ~ 125
2500
°C
°C
Vrms
Thermal Resistance
Item
Junction to Case Thermal
Resistance
Contact Thermal
Resistance
Symbol
Rth(j-c)Q
Rth(j-c)F
Rth(c-f)
Condition
Inverter IGBT Part (per 1/6 module)
Inverter FWDi Part (per 1/6 module)
Ceramic Substrate (per 1 Module)
Thermal Grease Applied (2nd Note 3)
2nd Notes:
2. For the measurement point of case temperature(TC), please refer to Figure 2.
3. The thickness of thermal grease should not be more than 100 m.
Min. Typ.
--
--
--
Max.
2.50
3.60
0.06
Unit
°C/W
°C/W
°C/W
©2003 Fairchild Semiconductor Corporation
FSAM15SH60A Rev. C8
5
www.fairchildsemi.com
5 Page 
Input Signal
Internal IGBT
Gate-Emitter Voltage
P5
P6
SC Detection
P1
Output Current
P2
P4
P7
Sensing Voltage
SC Reference
Voltage (0.5V)
RC Filter Delay
Fault Output Signal
P3
P8
P1 : Normal operation: IGBT ON and conducting current.
P2 : Short-circuit current detection.
P3 : IGBT gate interrupt / fault signal generation.
P4 : IGBT is slowly turned off.
P5 : IGBT OFF signal.
P6 : IGBT ON signal: but IGBT cannot be turned on during the fault-output activation.
P7 : IGBT OFF state.
P8 : Fault-output reset and normal operation start.
Figure 11. Short-Circuit Protection (Low-Side Operation Only)
5V
MCU
100
RPF =
4.7 k
100
100
1 nF
CPF =
1 nF
RPL =
2 k
RPH=
4.7 k
CPL =
0.47 nF
CPH=
1.2 nF
SPM
IN(UH) , IN(VH) , IN(WH)
IN(UL) , IN (VL) , IN(WL)
VFO
COM
Figure 12. Recommended MCU I/O Interface Circuit
3rd Notes:
1.
It would
SPM® 2
be recommended that by-pass capacitors for the gating input signals, IN(UL),
product pins and on the both sides of MCU and Motion SPM 2 Product for the
IN(VL), IN(WL), IN(UH), IN(VH) and
fault output signal, VFO, as close
IN(WH) should
as possible.
be
placed
on
the
Motion
2. The logic input works with standard CMOS or LSTTL outputs.
3. RPLCPL/RPHCPH/RPFCPF coupling at each Motion SPM 2 product input is recommended in order to prevent input/output signals’ oscillation and it should be as
close as possible to each of Motion SPM 2 Product pins.
©2003 Fairchild Semiconductor Corporation
FSAM15SH60A Rev. C8
11
www.fairchildsemi.com
11 Page | ||
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