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PDF HI-1579 Data sheet ( Hoja de datos )

Número de pieza HI-1579
Descripción 3.3V Monolithic Dual Transceivers
Fabricantes HOLTIC 
Logotipo HOLTIC Logotipo



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No Preview Available ! HI-1579 Hoja de datos, Descripción, Manual

July 2016
HI-1579, HI-1581
MIL-STD-1553 / 1760
3.3V Monolithic Dual Transceivers
DESCRIPTION
The HI-1579 and HI-1581 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 and MIL-STD-1760 specifications.
The transmitter section of each bus takes complementary
CMOS / TTL Manchester II bi-phase data and converts it to
differential voltages suitable for driving the bus isolation
transformer. Separate transmitter inhibit control signals are
provided for each transmitter.
The receiver section of the each bus converts the 1553 bus
bi-phase data to complementary CMOS / TTL data suitable
for input to a Manchester decoder. Each receiver has a
separate enable input, which forces the receiver outputs to
logic "0" (HI-1579) or logic 1 (HI-1581).
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer.
FEATURES
· Compliant to MIL-STD-1553A and B,
MIL-STD-1760 and ARINC 708A
· 3.3V single supply operation
PIN CONFIGURATIONS
-1
RXENA 2
GNDA 3
GNDA 4
GNDA 5
VDDB 6
VDDB 7
BUSB 8
BUSB 9
BUSB 10
BUSB 11
1579PCI
1579PCT
1579PCM
1581PCI
1581PCT
1581PCM
33 -
32 -
31 TXINHA
30 RXA
29 RXA
28 -
27 -
26 TXB
25 TXB
24 TXINHB
23 -
44 Pin Plastic 7mm x 7mm
Chip-scale package
VDDA 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1579PSI
1579PST
1579PSM
1581PSI
1581PST
1581PSM
20 TXA
19 TXA
18 TXINHA
17 RXA
16 RXA
15 TXB
14 TXB
13 TXINHB
12 RXB
11 RXB
20 Pin Plastic ESOIC - WB package
· Smallest footprint available in 7mm x 7mm
44 pin plastic chip-scale package (QFN)
· 1.0W typical power dissipation
(50% duty cycle)
· Industrial and extended temperature
ranges
· Industry standard pin configurations
VDDA 1
BUSA 2
BUSA 3
RXENA 4
GNDA 5
VDDB 6
BUSB 7
BUSB 8
RXENB 9
GNDB 10
1579CDI
1579CDT
1579CDM
1581CDI
1581CDT
1581CDM
20 TXA
19 TXA
18 TXINHA
17 RXA
16 RXA
15 TXB
14 TXB
13 TXINHB
12 RXB
11 RXB
20 Pin Ceramic DIP package
(DS1579 Rev. O)
HOLT INTEGRATED CIRCUITS
www.holtic.com
07/16

1 page




HI-1579 pdf
HI-1579, HI-1581
DC ELECTRICAL CHARACTERISTICS (cont.)
VDD = 3.3 V, GND = 0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL
CONDITION
MIN TYP MAX UNITS
TRANSMITTER (Measured at Point “AD” in Figure 3 unless otherwise specified)
Output Voltage
Direct coupled
VOUT
35 ohm load
(Measured at Point “AD“ in Figure 3)
Transformer coupled
VOUT
70 ohm load
(Measured at Point “AT“ in Figure 4)
Output Noise
VON Differential, inhibited
Output Dynamic Offset Voltage Direct coupled
VDYN
35 ohm load
(Measured at Point “AD“ in Figure 3)
Transformer coupled
VDYN
70 ohm load
(Measured at Point “AT“ in Figure 4)
Output Capacitance
COUT
1 MHz sine wave
6.1
20.0
-90
-250
9.0
27.0
10.0
90
250
15
Vp-p
Vp-p
mVp-p
mV
mV
pF
AC ELECTRICAL CHARACTERISTICS
VDD = 3.3 V, GND = 0V, TA =Operating Temperature Range (unless otherwise specified).
PARAMETER
SYMBOL TEST CONDITIONS
RECEIVER
(Measured at Point “AT” in Figure 4)
Receiver Delay
tDR From input zero crossing to RXA/B or RXA/B
MIN
Receiver gap time
tRG Spacing between RXA/B and RXA/B pulses
Receiver Enable Delay
tREN From RXENA/B rising or falling edge to
RXA/B or RXA/B
TRANSMITTER (Measured at Point “AD” in Figure 3)
Driver Delay
tDT TXA/B, TXA/B to BUSA/B, BUSA/B
Rise time
tr 35 ohm load
Fall Time
tf 35 ohm load
Inhibit Delay
tDI-H Inhibited output
tDI-L Active output
90
Note 1
100
100
TYP
MAX UNITS
450
Note 3
365
Note 2
40
ns
ns
ns
150 ns
300 ns
300 ns
100 ns
150 ns
Note 1. Measured using a 1 MHz sinusoid, 20 V peak to peak, line to line at point “AT” (Guaranteed but not tested).
Note 2. Measured using a 1 MHz sinusoid, 860 mV peak to peak, line to line at point “AT” (100% tested).
Note 3. Measured using a 1 MHz sinusoid, 860 mV peak to peak, line to line at point “AT”. Measured from input zero crossing point.
Transceiver A
Isolation
Transformer 55W
1:2.5
55W
Isolation
Transformer BUS B
Transceiver B
HI-1579 / HI-1581
1:2.5
BUS B
MIL-STD-1553
BUS A
(Direct Coupled)
BUS A
BUS A
MIL-STD-1553
Stub Coupler
52.5W
MIL-STD-1553
BUS B
(Transformer Coupled)
52.5W
1:1.4
Figure 2. Bus Connection Example using HI-1579 or HI-1581
HOLT INTEGRATED CIRCUITS
5

5 Page





HI-1579 arduino
PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
(07..20706)BSC
7.00
(0.276)
BSC
Top View
5.50 ± 0.050
(0.217 ± 0.002)
millimeters (inches)
Package Type: 44PCS
5.50 ± 0.050
(0.217 ± 0.002)
Bottom
View
0.50
(0.0197)
BSC
0.25 ± 0.050
(0.010 ± 0.002)
1.00
(0.039)
max
0.200
(0.008)
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
0.400 ± 0.050
(0.016 ± 0.002)
HOLT INTEGRATED CIRCUITS
11

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