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PDF MCP37221-200 Data sheet ( Hoja de datos )
| Número de pieza | MCP37221-200 | |
| Descripción | 16-/14-Bit Low-Power ADC | |
| Fabricantes | Microchip | |
| Logotipo |  |
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MCP37231/21-200
MCP37D31/21-200
200 Msps, 16-/14-Bit Low-Power ADC with 8-Channel MUX
Features
• Sample Rates:
- 200 Msps for single-channel mode
- 200 Msps/number of channels used
• SNR with fIN = 15 MHz and -1 dBFS:
- 74.7 dBFS (typical) at 200 Msps
• SFDR with fIN = 15 MHz and -1 dBFS:
- 90 dBc (typical) at 200 Msps
• Power Dissipation with LVDS Digital I/O:
- 490 mW at 200 Msps
• Power Dissipation with CMOS Digital I/O:
- 436 mW at 200 Msps, Output Clock = 100 MHz
• Power Dissipation Excluding Digital I/O:
- 390 mW at 200 Msps
• Power-Saving Modes:
- 144 mW during Standby
- 28 mW during Shutdown
• Supply Voltage:
- Digital Section: 1.2V, 1.8V
- Analog Section: 1.2V, 1.8V
• Selectable Full-Scale Input Range: up to 2.975 VP-P
• Input Channel Bandwidth: 500 MHz
• Channel-to-Channel Crosstalk in Multi-Channel
Mode (Input = 15 MHz, -1 dBFS): >95 dB
• Output Data Format:
- Parallel CMOS, DDR LVDS
- Serialized DDR LVDS (16-bit, octal-channel mode)
• Optional Output Data Randomizer
• Serial Peripheral Interface (SPI)
• Digital Signal Post-Processing (DSPP) Options:
- Decimation filters for improved SNR
- Fractional Delay Recovery (FDR) for time-
delay corrections in multi-channel operations
(dual-/octal-channel modes)
- Phase, Offset and Gain adjust of individual
channels
- Digital Down-Conversion (DDC) with I/Q or
fS/8 output (MCP37D31/21-200)
- Continuous wave beamforming for octal-
channel mode (MCP37D31/21-200)
• Built-In ADC Linearity Calibration Algorithms:
- Harmonic Distortion Correction (HDC)
- DAC Noise Cancellation (DNC)
- Dynamic Element Matching (DEM)
- Flash Error Calibration
• AutoSync Mode to Synchronize Multiple Devices
to the Same Clock
• Package Options:
- VTLA-124 (9 mm x 9 mm x 0.9 mm)
- TFBGA-121 (8 mm x 8 mm x 1.08 mm)
• No External Reference Decoupling Capacitor
Required for TFBGA Package
• Industrial Temperature Range: -40°C to +85°C
Typical Applications
• Communication Instruments
• Cellular Base Stations
• Radar
• Ultrasound and Sonar Imaging
• Scanners and Low-Power Portable Instruments
• Industrial and Consumer Data Acquisition System
MCP372XX/MCP37DXX Family Comparison(1):
Part Number
Sample Rate
Resolution
Digital
Digital
CW
Decimation(2) Down-Conversion(3) Beamforming(4)
Noise-Shaping
Requantizer(2)
MCP37231-200 200 Msps
16
Yes
No
No
MCP37221-200 200 Msps
14
Yes
No
No
MCP37211-200 200 Msps
12
Yes
No
No
MCP37D31-200 200 Msps
16
Yes
Yes
Yes
MCP37D21-200 200 Msps
14
Yes
Yes
Yes
MCP37D11-200 200 Msps
12
Yes
Yes
Yes
Note 1:
2:
3:
4:
Devices in the same package type are pin-to-pin compatible.
Available in single- and dual-channel mode.
Available in single- and dual-channel mode, and octal-channel mode when CW beamforming is enabled.
Available in octal-channel mode.
No
No
Yes
No
No
Yes
2014-2016 Microchip Technology Inc.
DS20005322D-page 1
1 page  
MCP37231/21-200 AND MCP37D31/21-200
1.0 PACKAGE PIN CONFIGURATIONS
AND FUNCTION DESCRIPTIONS
Top View
(Not to Scale)
A68
A1
A2
AIN6+ A3
AIN2+ A4
AIN4+ A5
AIN0+ A6
VCMIN A7
AIN1- A8
AIN7- A9
AIN3- A10
AIN5- A11
A12
A13
A14
A15
NC
A16
NC
A67
AVDD18 GND AVDD12 REF0- REF0+ AVDD12 VBG REF1- REF1+ AVDD12 VCM
A66 A65 A64 A63 A62 A61 A60 A59 A58 A57 A56 A55
SCLK SDIO
A54 A53
A52
B56 B55 B54 B53 B52 B51 B50 B49 B48 B47 B46 B45 B44 B43 B42
Note 2
AVDD18 REF0- REF0+
SENSE REF1- REF1+
CS DVDD18
B1 AVDD18
B41
B2 AIN6-
B3 AIN2-
B4 AIN4-
VTLA-124
(9 mm x 9 mm x 0.9 mm)
B40
DVDD12 B39
WCK/OVR+
(OVR) B38
B5 AIN0-
Q15/Q7+ B37
B6 AIN1+
B7 AIN7+
B8 AIN3+
EP
(GND)
Note 3
DVDD18 B36
Q12/Q6- B35
Q10/Q5- B34
B9 AIN5+
Q9/Q4+ B33
B10 Q7/Q3+ B32
B11
AVDD12
B12
DVDD18 B31
Q4/Q2- B30
B13
B14
AVDD12
B15 B16
Note 1
CLK- ADR0 SYNC GND RESET DCLK+ DM2/DM- DVDD18 Q1/Q0+ Q2/Q1- DVDD18
B29
B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28
NC
A51
A50 Note 2
A49
A48
A47
A46
A45
WCK/OVR-
(WCK)
A44 Q14/Q7-
A43 Q13/Q6+
A42 Q11/Q5+
A41 DVDD18
A40 Q8/Q4-
A39 Q6/Q3-
A38 Q5/Q2+
A37
A36
NC
A35
A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34
Note 2
CLK+ AVDD18 SLAVE
DVDD12 CAL DCLK- DM1/DM+ Q0/Q0- DVDD12 Q3/Q1+
Note 2
Note 1: Tie to GND or DVDD18. ADR1 is internally bonded to GND.
2: NC – Not connected pins. These pins can float or be tied to ground.
3: Exposed pad (EP – back pad of the package) is the common ground (GND) for analog and digital
supplies. Connect this pad to a clean ground reference on the PCB.
FIGURE 1-1:
VTLA-124 Package. See Table 1-1 for the pin descriptions and Table 1-3 for active
and inactive ADC output pins for various ADC resolution modes.
2014-2016 Microchip Technology Inc.
DS20005322D-page 5
5 Page 
MCP37231/21-200 AND MCP37D31/21-200
Top View
(Not to Scale)
1 2 3 4 5 6 7 8 9 10 11
A SDIO VCM REF1+ REF1- VBG REF0+ REF0- GND GND AIN4- AIN2+
B SCLK CS
GND GND SENSE AVDD12 AVDD12 AVDD18 AVDD18 AIN4+ AIN2-
C
WCK/ WCK/
OVR- OVR+
(WCK) (OVR)
GND
GND AVDD12 AVDD12 AVDD12 GND
D Q14/Q7- Q15/Q7+ GND GND AVDD12 AVDD12 AVDD12 GND
GND AIN6- AIN0+
GND AIN6+ AIN0-
E Q12/Q6- Q13/Q6+ GND GND AVDD12 AVDD12 AVDD12 GND GND AIN5+ AIN1+
F Q10/Q5- Q11/Q5+ DVDD18 DVDD18 AVDD12 AVDD12 AVDD12 GND GND AIN5- AIN1-
G Q8/Q4- Q9/Q4+ DVDD18 DVDD18 GND GND AVDD12 AVDD12 GND AIN7- AIN3+
H Q6/Q3- Q7/Q3+ DVDD12 DVDD12 GND GND GND GND GND AIN7+ AIN3-
J Q4/Q2- Q5/Q2+ DVDD12 DVDD12 GND GND GND GND GND VCMIN+ VCMIN-
K Q2/Q1- Q3/Q1+ DM1/DM+ DCLK- CAL GND SLAVE ADR0 ADR1 GND GND
L Q0/Q0- Q1/Q0+ DM2/DM- DCLK+ RESET SYNC GND CLK+ CLK- GND AVDD18
All others:
Analog
Digital
Supply Voltage
Notes:
• Die dimension: 8 mm x 8 mm x 1.08 mm.
• Ball dimension: (a) Ball Pitch = 0.65 mm, (b) Ball Diameter = 0.4 mm.
• Flip-chip solder ball composition: Sn with Ag 1.8%.
• Solder sphere composition: SAC-405 (Sn/Au 4%/Cu 0.5%).
FIGURE 1-2:
TFBGA-121 Package. See Table 1-2 for the pin descriptions and Table 1-3 for active
and inactive ADC output pins for various ADC resolution modes.
2014-2016 Microchip Technology Inc.
DS20005322D-page 11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MCP37221-200.PDF ] | |
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