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PDF ESTW010A0A Data sheet ( Hoja de datos )
| Número de pieza | ESTW010A0A | |
| Descripción | DC-DC Converter Power Modules | |
| Fabricantes | Lineage Power | |
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Data Sheet
November 29, 2011
ESTW010A0A Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
STINGRAY™ SERIES
RoHS Compliant
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Industrial Equipment
Options
Negative Remote On/Off logic (preferred)
Over current/Over temperature/Over voltage
protections (Auto-restart) (preferred)
Heat plate version (-H)
Surface Mount version (-S)
RoHS 6/6 compliant; Lead Free (-Z)
For additional options, see Table 2 (Device Options)
under “Ordering Information” section.
Features
Wide input voltage range: 36-75 Vdc
Monotonic startup into prebiased load
Output Voltage adjust: 80% to 110% of Vo,nom
Remote sense
Constant switching frequency
Positive remote On/Off logic
Input under/over voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Low profile height and reduced component skyline
Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module
High efficiency: 91%
No thermal derating up to 80 °C, 1.0m/s (200 LFM)
Wide operating temperature range (-40°C to 85°C)
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1, 2nd
Ed.) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ISO**9001 and ISO 14001 certified manufacturing
facilities
Description
The ESTW010A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A
of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN =
36 - 75Vdc). The modules achieve typical full load efficiency of 91%. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS11-006 ver. 1.01
PDF name: ESTW010A.pdf
1 page  
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
Characteristic Curves
The following figures provide typical characteristics for the module at 25oC. The figures are identical for either
positive or negative remote On/Off logic.
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current.
TIME, t (200µs/div)
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=48V.
TIME, t (2 s/div)
Figure 2. Typical output ripple and noise (Vin=48V, Io =
Io,max).
TIME, t (20ms/div)
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = 48V, Io = Io,max).
TIME, t (200µs/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load,
Vin=48V.
TIME, t (20ms/div)
Figure 6. Typical Start-up Using Input Voltage (VIN =
48V, Io = Io,max).
LINEAGE POWER
5
5 Page 
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
Surface Mount Information
Pick and Place
The modules use an open frame construction and are
designed for a fully automated assembly process.
The modules are fitted with a label designed to
provide a large surface area for pick and place
operations. The label meets all the requirements for
surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
LINEAGE POWER
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 23. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the modules are lead-free (Pb-free)
and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Reflow Soldering Information
The surface mountable modules in the family use our
newest SMT technology called “Column Pin” (CP)
connectors. Figure 24 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
11
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