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PDF AE512 Data sheet ( Hoja de datos )
| Número de pieza | AE512 | |
| Descripción | E-pHEMT MMIC | |
| Fabricantes | RFHIC | |
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E-pHEMT MMIC
Product Features
• 30 ~ 2150MHz
• High Gain
• High linearity
• SOIC-8 SMD Type package
• Lower manufacturing cost
• Low Noise Figure
• -65dBc CSO 79 Channels @ +30dBmV/ch
• -61dBc CTB 79 Channels @ +30dBmV/ch
AE512
Applications
• Low Noise Amplifier for CATV
• Cable Modem
• FTTH (G-PON, GE-PON)
• Optical node
Package Type : SOIC-8
Description
AE512 is designed as low cost drive amplifiers for many applications including FTTH, CATV System.
This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise.
The data in this spec sheet is valid only for 75ohm application. 50ohm data is in a separate spec sheet.
Electrical Specifications
PARAMETER
Frequency
UNIT
MHz
MIN
30
TYP
-
MAX
2150
Gain
15 17
dB 13 15
-
-
Gain Flatness
dB - 0.4 -
Input Return Loss
dB - -12 -
Output Return Loss
dB - -13 -
Output IP3
dBm 30
34
-
1dB Compression Point
dBm 18
20
-
Noise Figure
dB - 1.5 2.0
CSO
CTB
dBc - -65 -60
30 ~ 1004MHz
dBc - -61 -56
DC Current
mA - 100 -
Note
1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=5V, 75Ω system
2. OIP3 measured with 2 tones at an output power of +5dBm/tone separated by 1MHz, Test Freq = 500MHz
CONDITION
-
30 ~ 1000MHz
50 ~ 2150MHz
30 ~ 1000MHz
-
-
@ 500MHz/5dBm 2tone
@500MHz
30 ~ 1000MHz
79 channel, +30dBmV/ch
Vdd = 5.0V
Absolute Maximum Ratings
PARAMETER
Device Voltage
Operating Temperature
Storage Temperature
ESD Human Body Model
Moisture Sensitivity Level
Junction Temperature (Tj)
Thermal Resistance (Rth)
UNIT
VDC
℃
℃
-
-
℃
℃/W
MIN
-
-40
-40
-
-
-
-
TYP
5
-
-
Class 1B
MSL1
-
40
MAX
8
85
150
-
-
180
-
Korean Facilities : 82-31-8069-3036 / [email protected]
US Facility : 919-677-8780 / [email protected]
1/6
All specifications may change without notice
Version 1.3
1 page  
E-pHEMT MMIC
AE512
Package Dimensions (Type: SOIC-8)
* Unit: mm[inch] | Tolerance ±0.2[.008]
Pin No
1
2
3
4
Recommended Pattern
Pin Description
Function
Pin No
RF IN(2)
5
GND
6
GND
7
RF IN(1)
8
Function
RF OUT(1)
GND
GND
RF OUT(2)
Mounting Configuration Notes
1. Ground / thermal via holes are critical for the proper
performance of this device.
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heat sink. Ensure that the ground / thermal via hole
region contacts the heat sink.
4. Do not put solder mask on the backside of the PCB in the
region where the board contacts the heat sink.
5. RF trace width depends upon the PCB material and
construction.
6. Use 1 oz. Copper minimum.
Korean Facilities : 82-31-8069-3036 / [email protected]
US Facility : 919-677-8780 / [email protected]
5/6
All specifications may change without notice
Version 1.3
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet AE512.PDF ] | |
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