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Número de pieza HMC829LP6GE
Descripción FRACTIONAL-N PLL
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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HMC829LP6GE
v01.0911
FRACTIONAL-N PLL WITH INTEGRATED VCO
45 - 1050, 1400 - 2100, 2800 - 4200 MHz
Features
RF Bandwidth:
45 - 1050, 1400 - 2100, 2800 - 4200 MHz
Maximum Phase Detector Rate
100 MHz
Ultra Low Phase Noise
-110 dBc/Hz in Band Typ.
Figure of Merit (FOM) -227 dBc/Hz
<180 fs RMS Jitter
24-bit Step Size, Resolution 3 Hz typ
Exact Frequency Mode
Built in Digital Self Test
40 Lead 6x6 mm SMT Package: 36 mm2
Typical Applications
Cellular/4G, WiMax Infrastructure
Repeaters and Femtocells
Communications Test Equipment
CATV Equipment
Functional Diagram
Phased Array Applications
DDS Replacement
Very High Data Rate Radios
Tunable Reference Source for Spurious-
Free Performance
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1 page




HMC829LP6GE pdf
HMC829LP6GE
v01.0911
FRACTIONAL-N PLL WITH INTEGRATED VCO
45 - 1050, 1400 - 2100, 2800 - 4200 MHz
Electrical Specifications (Continued)
Parameter
Condition
Min.
Typ.
Max.
Units
+3.3V
AVDD, VCCHF, VCCPS,
VCCPD, RVDD, DVDD3V
52
mA
Power Down - Crystal Off
Reg 01h=0,
Crystal Not Clocked
10 µA
Power Down - Crystal On, 100 MHz
Reg01h =0,
Crystal Clocked 100 MHz
10 30 mA
Power on Reset
Typical Reset Voltage on DVDD
700 mV
Min DVDD Voltage for No Reset
1.5 V
Power on Reset Delay
250 µs
VCO Open Loop Phase Noise at fo @ 4 GHz
10 kHz Offset
-78 dBc/Hz
100 kHz Offset
-108
dBc/Hz
1 MHz Offset
-134.5
dBc/Hz
10 MHz Offset
-156
dBc/Hz
100 MHz Offset
-171 dBc/Hz
VCO Open Loop Phase Noise at fo @ 4 GHz/2 = 2 GHz
10 kHz Offset
-83 dBc/Hz
100 kHz Offset
-113 dBc/Hz
1 MHz Offset
-139.5
dBc/Hz
10 MHz Offset
-165.5
dBc/Hz
100 MHz Offset
-167
dBc/Hz
VCO Open Loop Phase Noise at fo @ 2.8 GHz/28 = 100 MHz
10 kHz Offset
-111 dBc/Hz
100 kHz Offset
-141 dBc/Hz
1 MHz Offset
-163.5
dBc/Hz
10 MHz Offset
-170 dBc/Hz
100 MHz Offset
-173 dBc/Hz
Figure of Merit
Floor Integer Mode
Normalized to 1 Hz
-230
dBc/Hz
Floor Fractional Mode
Normalized to 1 Hz
-227
dBc/Hz
Flicker (Both Modes)
Normalized to 1 Hz
-268
dBc/Hz
VCO Characteristics
VCO Tuning Sensitivity at 4053 MHz
Measured at 2.5 V
15 MHz/V
VCO Tuning Sensitivity at 3777 MHz
Measured at 2.5 V
13 MHz/V
VCO Tuning Sensitivity at 3411 MHz
Measured at 2.5 V
12 MHz/V
VCO Tuning Sensitivity at 2943 MHz
Measured at 2.5 V
11.5 MHz/V
VCO Supply Pushing
Measured at 2.5 V
2 MHz/V
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HMC829LP6GE arduino
HMC829LP6GE
v01.0911
FRACTIONAL-N PLL WITH INTEGRATED VCO
45 - 1050, 1400 - 2100, 2800 - 4200 MHz
Absolute Maximum Ratings
AVDD, RVDD, DVDD3V, VCCPD,
VCCHF, VCCPS
VPPCP, VDDLS, VCC1, VCC2
Operating Temperature
Storage Temperature
Maximum Junction Temperature
-0.3V to +3.6V
-0.3V to +5.5V
-40°C to +85°C
-65°C to 150°C
125 °C
Thermal Resistance (RTH)
(junction to ground paddle)
Reflow Soldering
Peak Temperature
Time at Peak Temperature
ESD Sensitivity (HBM)
20 °C/W
260°C
40 sec
Class 1B
Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device at these or any other conditions above those
indicated in the operational section of this specification
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Outline Drawing
Package Information
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA
AND SILICON IMPREGNATED.
2. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25mm
MAX.
7. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF
GROUND.
9. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN.
Part Number
Package Body Material
RoHS-compliant Low Stress Injection Molded Plastic
[1] 4-Digit lot number XXXX
Lead Finish
100% matte Sn
MSL Rating
MSL1
Package Marking [1]
H829
XXXX
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