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PDF HMC641ALC4 Data sheet ( Hoja de datos )

Número de pieza HMC641ALC4
Descripción GaAs MMIC SP4T NON-REFLECTIVE SWITCH
Fabricantes Analog Devices 
Logotipo Analog Devices Logotipo



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No Preview Available ! HMC641ALC4 Hoja de datos, Descripción, Manual

v00.0713
Typical Applications
The HMC641ALC4 is ideal for:
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space Hybrids
• Test Instrumentation
• SATCOM & Sensors
Functional Diagram
HMC641ALC4
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 20 GHz
Features
Broadband Performance: DC - 20 GHz
High Isolation: 42 dB @ 12 GHz
Low Insertion Loss: 2.1 dB @ 12 GHz
Integrated 2:4 TTL Decoder
24 Lead 4x4mm SMT Package: 16mm²
General Description
The HMC641ALC4 is a broadband non-reflective
GaAs pHEMT SP4T switch in a compact 4x4 mm
ceramic package. Covering DC to 20 GHz, this switch
offers high isolation, low insertion loss and on-chip
termination of isolated ports. This switch also includes
an on board binary decoder circuit which reduces
the number of required logic control lines from four to
two. The HMC641ALC4 is controlled with 0/ -5V logic,
exhibits fast switching speed and consumes much
less DC current than pin diode based solutions.
Electrical Specifications, TA = +25° C, With 0/-5V Control, Vss = -5V, 50 Ohm System
Parameter
Frequency
Min.
Typ.
Max.
Units
Insertion Loss
DC - 12 GHz
DC - 20 GHz
1.8 2.8 dB
2.3 3.5 dB
Isolation (RFC to RF1 - RF4)
DC - 12 GHz
DC - 20 GHz
30 42
30 40
dB
dB
Return Loss
“On State”
DC - 12 GHz
DC - 20 GHz
18 dB
17 dB
Return Loss
“Off State”
DC - 20 GHz
19 dB
Input Power for 1 dB Compression
0.05 - 0.25 GHz
0.25- 20 GHz
10
20
15
25
dBm
dBm
Input Third Order Intercept
(Two-Tone Input Power= +10 dBm Each Tone)
0.05 - 0.25 GHz
0.25 - 20 GHz
32 dBm
41 dBm
Switching Characteristics
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
DC - 20 GHz
30 ns
100 ns
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1 page




HMC641ALC4 pdf
Outline Drawing
v00.0713
HMC641ALC4
GaAs MMIC SP4T NON-REFLECTIVE
SWITCH, DC - 20 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER
50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC641ALC4
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 [1]
Package Marking [2]
H641A
XXXX
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