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PDF ADR225 Data sheet ( Hoja de datos )
| Número de pieza | ADR225 | |
| Descripción | Micropower 2.5 V Reference | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de ADR225 (archivo pdf) en la parte inferior de esta página. Total 13 Páginas | ||
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Data Sheet
FEATURES
Extreme high temperature operation
−40°C to +210°C, 8-lead FLATPACK
−40°C to +175°C, 8-lead SOIC
Temperature coefficient
40 ppm/°C, 8-lead FLATPACK
10 ppm/°C, 8-lead SOIC
High output current: 10 mA
Low supply current: 50 µA maximum
Initial accuracy: ±0.4% (±10 mV maximum), 8-lead SOIC
Low dropout voltage
Wide supply range: 3.3 V to 16 V
APPLICATIONS
Down-hole drilling and instrumentation
Avionics
Heavy industrial
High temperature environments
GENERAL DESCRIPTION
The ADR225 is a precision 2.5 V band gap voltage reference
specified for a high temperature operation of 175°C and 210°C.
It uses a micropower core topology and laser trimming of highly
stable, thin film resistors to achieve a temperature coefficient of
30 ppm/°C (maximum) up to 175°C and an initial accuracy of 0.4%
(±10 mV maximum). A maximum operating current of 50 µA
and a low dropout voltage allow the ADR225 to function very
well in battery-powered equipment.
The ADR225 voltage reference is offered in an 8-lead SOIC
package with an operating temperature range of −40°C to +175°C.
High Temperature, Low Drift,
Micropower 2.5 V Reference
ADR225
PIN CONFIGURATION
NC 1
8 NC
VS 2 ADR225 7 NC
NC 3 TOP VIEW 6 OUTPUT
(Not to Scale)
GND 4
5 NC
NOTES
1. NC = NO CONNECT. DO NOT
CONNECT TO THIS PIN.
Figure 1. Pin Configuration for SOIC and FLATPACK Packages
It is also available in an 8-lead ceramic flat pack (FLATPACK)
with an operating temperature range of −40°C to +210°C. Both
devices are designed for robustness at extreme temperatures
and are qualified for 1000 hours of operation at the maximum
temperature rating.
The ADR225 is a member of a growing series of high temperature
qualified products offered by Analog Devices, Inc. For a complete
selection table of the available high temperature products, see
the high temperature product list and qualification data available
at www.analog.com/hightemp.
Rev. B
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
1 page  
ADR225
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
OUTPUT to GND
Storage Temperature Range
Operating Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Junction Temperature Range
8-Lead SOIC
8-Lead FLATPACK
Lead Temperature (Soldering 60 sec)
Rating
−0.3 V to +18 V
−0.3 V to VS + 0.3 V
−65°C to +150°C
−40°C to +175°C
−40°C to +210°C
−40°C to +200°C
−40°C to +245°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME vs. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the ADR225.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism
assumptions. HTOL is performed to JEDEC JESD22-A108. A
minimum of three wafer fab and assembly lots are processed
through HTOL at the maximum operating temperature.
Comprehensive reliability testing is performed on all Analog
Devices, Inc., high temperature (HT) products.
Data Sheet
100k
10k
1k
100
10
1
120 130 140 150 160 170 180 190 200 210
OPERATING TEMPERATURE (°C)
Figure 2. Predicted Lifetime vs. Operating Temperature
THERMAL RESISTANCE
θJA is specified for worst-case conditions; that is, θJA is specified
for the device soldered in the circuit board.
Table 3.
Package Type
8-Lead SOIC
8-Lead FLATPACK
θJA θJC
121 43
100 15
Unit
°C/W
°C/W
ESD CAUTION
Rev. B | Page 4 of 12
5 Page 
ADR225
OUTLINE DIMENSIONS
Data Sheet
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
8
1
5
6.20 (0.2441)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.31 (0.0122)
0.50 (0.0196)
0.25 (0.0099)
45°
8°
0°
1.27 (0.0500)
0.25 (0.0098) 0.40 (0.0157)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 26. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
0.053
0.050
0.047
0.155
0.150
0.145
0.006
0.005
0.004
0.260
0.255 SQ
0.250
0.195
0.190 SQ
0.185
18
1.00
45
0.012 R
TYP
TOP VIEW
END VIEW
0.175
0.019
0.017
0.015
0.091
0.083
0.075
0.026 MIN
IDEX
MARK
BOTTOM VIEW
0.024
SIDE VIEW
0.007
MIN
Figure 27. 8-Lead Ceramic Flat Package [FLATPACK]
(F-8-2)
Dimensions shown in inches
0.035
TYP
0.05 TYP
0.054
0.044
0.034
ORDERING GUIDE
Model1
ADR225HRZN
ADR225HFZ
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +175°C
−40°C to +210°C
Package Description
8-Lead Standard Small Outline Package [SOIC_N]
8-Lead Ceramic Flat Package [FLATPACK]
Package Option
R-8
F-8-2
Rev. B | Page 10 of 12
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet ADR225.PDF ] | |
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