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S70FL01GS fiches techniques PDF

Cypress Semiconductor - 1 Gbit (128 Mbyte) 3.0V SPI Flash

Numéro de référence S70FL01GS
Description 1 Gbit (128 Mbyte) 3.0V SPI Flash
Fabricant Cypress Semiconductor 
Logo Cypress Semiconductor 





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S70FL01GS fiche technique
S70FL01GS
1 Gbit (128 Mbyte) 3.0V SPI Flash
Features
CMOS 3.0V Core
Serial Peripheral Interface (SPI) with Multi-I/O
– SPI Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Extended Addressing: 32-bit address
– Serial Command set and footprint compatible with
S25FL-A, S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad
DDR
– AutoBoot – power up or reset and execute a Normal or
Quad read command automatically at a preselected
address
– Common Flash Interface (CFI) data for configuration
information
Programming (1.5 Mbytes/s)
– 512-byte Page Programming buffer
– Quad-Input Page Programming (QPP) for slow clock
systems
– Automatic Error Correction Code (ECC): Internal hardware
ECC generation with single bit error correction
Erase (0.5 Mbytes/s)
– Uniform 256-kbyte sectors
Cycling Endurance
– 100,000 Program-Erase Cycles, minimum
Data Retention
– 20 Year Data Retention, minimum
Security Features
One Time Program (OTP) array of 1024 bytes
Block Protection
– Status Register bits to control protection against program
or erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or
password
Cypress® 65-nm MirrorBit® Technology with Eclipse
Architecture
Core Supply Voltage: 2.7V to 3.6V
I/O Supply Voltage: 1.65V to 3.6V
Temperature Range / Grade:
– Industrial (40 °C to +85 °C)
– Industrial Plus (40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 3 (40 °C to +85 °C)
– Automotive, AEC-Q100 Grade 2 (40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 1 (40 °C to +125 °C)
Packages (all Pb-free)
– 16-lead SOIC (300 mils)
– BGA-24, 8 6 mm
– 5 5 ball (ZSA024) footprint
General Description
This document contains information for the S70FL01GS device, which is a dual die stack of two S25FL512S die. For detailed
specifications, refer to the discrete die datasheet provided in the Affected Documents/Related Documents table.
Affected Documents/Related Documents
Document Title
S25FL512S 512 Mbit (64 Mbyte) 3.0V SPI Flash Memory Datasheet
Publication Number
001-98284
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-98295 Rev. *K
• San Jose, CA 95134-1709 • 408-943-2600
Revised February 08, 2017

PagesPages 18
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