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PDF HS-5104AEH Data sheet ( Hoja de datos )
| Número de pieza | HS-5104AEH | |
| Descripción | Radiation Hardened Low Noise Quad Operational Amplifier | |
| Fabricantes | Intersil | |
| Logotipo |  |
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DATASHEET
Radiation Hardened, Low Noise Quad Operational
Amplifiers
HS-5104ARH, HS-5104AEH
The HS-5104ARH, HS-5104AEH are radiation hardened,
monolithic quad operational amplifiers that provide highly
reliable performance in harsh radiation environments.
Excellent noise characteristics coupled with a unique array of
dynamic specifications make these amplifiers well-suited for a
variety of satellite system applications. Dielectrically isolated,
bipolar processing makes these devices immune to Single
Event Latch-Up.
The HS-5104ARH, HS-5104AEH show almost no change in offset
voltage after exposure to 100kRAD(Si) gamma radiation, with
only a minor increase in current. Complementing these
specifications is a post radiation open loop gain in excess of 40k.
These quad operational amplifiers are available in an industry
standard pinout, allowing for immediate interchangeability
with most other quad operational amplifiers.
Features
• Electrically screened to SMD # 5962-95690
• QML qualified per MIL-PRF-38535 requirements
• Radiation environment
- High dose rate (50-300rad(Si)/s). . . . . . . . . . . 100krad(Si)
- Low dose rate (0.01rad(Si)/s) . . . . . . . . . . . . . . .50krad(Si)
• No latch-up, dielectrically isolated device islands
• Low noise
- At 1kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3nV/Hz (Typ)
- At 1kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6pA/Hz (Typ)
• Low offset voltage . . . . . . . . . . . . . . . . . . . . . . . . . 3.0mV (Max)
• High slew rate . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0V/µs (Typ)
• Gain bandwidth product . . . . . . . . . . . . . . . . . . . .8.0MHz (Typ)
Applications
• High Q, active filters
• Voltage regulators
• Integrators
• Signal generators
• Voltage references
• Space environment
Ordering Information
ORDERING/SMD NUMBER
INTERNAL
MKT. NUMBER
(NOTE 1 )
TEMP. RANGE
(°C)
PART
MARKING
PACKAGE
(RoHS Compliant)
(NOTE 2)
PKG. DWG. #
5962R9569001VXC
HS9-5104ARH-Q
-55 to +125
Q 5962R95 69001VXC 14 Ld Flatpack
K14.A
5962R9569002VXC
HS9-5104AEH-Q
-55 to +125
Q 5962R95 69002VXC 14 Ld Flatpack
K14.A
5962R9569001VCC
HS1-5104ARH-Q
-55 to +125
Q 5962R95 69001VCC 14 Ld SBDIP
D14.3
5962R9569002VCC
HS1-5104AEH-Q
-55 to +125
Q 5962R95 69002VCC 14 Ld SBDIP
D14.3
5962R9569001V9A
HS0-5104ARH-Q
-55 to +125
Die
5962R9569002V9A
HS0-5104AEH-Q
-55 to +125
Die
HS1-5104ARH/PROTO
HS1-5104ARH/PROTO
-55 to +125
HS1-5104ARH/PROTO 14 Ld SBDIP
D14.3
HS0-5104ARH/SAMPLE
HS0-5104ARH/SAMPLE
-55 to +125
Die
HS9-5104ARH/PROTO
HS9-5104ARH/PROTO
-55 to +125
HS9-5104ARH/PROTO 14 Ld Flatpack
K14.A
1. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in
the“Ordering Information” table must be used when ordering.
2. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with
both SnPb and Pb-free soldering operations.
July 12, 2013
FN3025.5
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas LLC 2002, 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
1 page  
HS-5104ARH, HS-5104AEH
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
-A- -D-
E
-B-
bbb S C A - B S D S
c1 LEAD FINISH
BASE
METAL
(c)
b1
MM
(b)
SECTION A-A
BASE
PLANE
SEATING
PLANE
D
S1
b2
b
AA
e
ccc M C A - B S D S
S2 Q
-C- A
L
eA
eA/2
c
aaa M C A - B S D S
NOTES:
1. Index area: A notch or a pin one identification mark shall be located
adjacent to pin one and shall be located within the shaded area
shown. The manufacturer’s identification shall not be used as a pin
one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be mea-
sured at the centroid of the finished lead surfaces, when solder dip
or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension M
applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a par-
tial lead paddle. For this configuration dimension b3 replaces di-
mension b2.
5. Dimension Q shall be measured from the seating plane to the base
plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the near-
est metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
D14.3 MIL-STD-1835 CDIP2-T14 (D-1, CONFIGURATION C)
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A
- 0.200 - 5.08
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
- 0.785 - 19.94
-
E
0.220
0.310
5.59
7.87
-
e 0.100 BSC
2.54 BSC
-
eA 0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1 0.005 - 0.13 - 6
S2 0.005 - 0.13 - 7
90o 105o 90o 105o
-
aaa - 0.015 - 0.38 -
bbb - 0.030 - 0.76 -
ccc
- 0.010 - 0.25
-
M
-
0.0015
-
0.038
2
N 14
14 8
Rev. 0 4/94
5 FN3025.5
July 12, 2013
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