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PDF PZTA42T1 Data sheet ( Hoja de datos )
| Número de pieza | PZTA42T1 | |
| Descripción | High Voltage Transistor Surface Mount | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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ON Semiconductort
High Voltage Transistor
Surface Mount
NPN Silicon
MAXIMUM RATINGS
Rating
Collector-Emitter Voltage (Open Base)
Collector-Base Voltage (Open Emitter)
Emitter-Base Voltage (Open Collector)
Collector Current (DC)
Total Power Dissipation @ TA = 25°C(1)
Storage Temperature Range
Junction Temperature
DEVICE MARKING
P1D
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction-to-Ambient(1)
Symbol
VCEO
VCBO
VEBO
IC
PD
Tstg
TJ
Symbol
RθJA
Value
300
300
6.0
500
1.5
–65 to +150
150
Max
83.3
Unit
Vdc
Vdc
Vdc
mAdc
Watts
°C
°C
Unit
°C/W
PZTA42T1
ON Semiconductor Preferred Device
SOT–223 PACKAGE
NPN SILICON
HIGH VOLTAGE
TRANSISTOR
SURFACE MOUNT
4
1
2
3
CASE 318E-04, STYLE 1
TO-261AA
COLLECTOR 2,4
BASE
1
EMITTER 3
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics
Symbol
Min
Max Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage(2)
(IC = 1.0 mAdc, IB = 0)
V(BR)CEO
300
— Vdc
Collector-Base Breakdown Voltage
(IC = 100 µAdc, IE = 0)
V(BR)CBO
300
— Vdc
Emitter-Base Breakdown Voltage
(IE = 100 µAdc, IC = 0)
V(BR)EBO
6.0
— Vdc
Collector-Base Cutoff Current
(VCB = 200 Vdc, IE = 0)
ICBO
—
0.1 µAdc
Emitter-Base Cutoff Current
(VBE = 6.0 Vdc, IC = 0)
IEBO
—
0.1 µAdc
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min 0.93 in2.
2. Pulse Test Conditions, tp = 300 µs, δ = 0.02.
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 4
1
Publication Order Number:
PZTA42T1/D
1 page  
PZTA42T1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SOT-223 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
http://onsemi.com
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet PZTA42T1.PDF ] | |
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