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CURA153 fiches techniques PDF

Comchip Technology - SMD Ultra Fast Recovery Rectifier

Numéro de référence CURA153
Description SMD Ultra Fast Recovery Rectifier
Fabricant Comchip Technology 
Logo Comchip Technology 





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CURA153 fiche technique
SMD Ultra Fast Recovery Rectifier
CURA151 Thru CURA157
Reverse Voltage: 50 - 1000 Volts
Forward Current: 1.5 Amp
COMCHIP
www.comchip.com.tw
Features
Ideal for surface mount applications
Easy pick and place
Plastic package has Underwriters Lab.
flammability classification 94V-0
Fast recovery time: 50 - 75 nS
Low leakage current
Mechanical data
Case: JEDEC DO-214AC molded plastic
Terminals: solderable per MIL-STD-750,
method 2026
Polarity: Color band denotes cathode
end
Mounting position: Any
Approx. Weight: 0.063 gram
DO-214AC (SMA)
0.067(1.70)
0.051(1.29)
0.180(4.57)
0.160(4.06)
0.091(2.31)
0.067(1.70)
0.059(1.50)
0.035(0.89)
0.209(5.31)
0.185(4.70)
0.110(2.79)
0.086(2.18)
0.012(0.31)
0.006(0.15)
0.008(0.20)
0.004(0.10)
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characterics
Parameter
Symbol
Max. Repetitive Peak Reverse Voltage VRRM
CURA
151
50
Max. DC Blocking Voltage
VDC
50
Max. RMS Voltage
VRMS
35
Peak Surge Forward Current
8.3ms single half sine-wave
superimposed on rate load
( JEDEC method )
IFSM
Max. Average Forward Current
Io
Max. Instantaneous Forward Current
at 1.5 A
VF
Reverse recovery time
Trr
Max. DC Reverse Current at Rated DC
Blocking Voltage
Ta=25 C
Ta=100C
IR
Max. Thermal Resistance (Note 1)
R JL
Operating Junction Temperature
Tj
Storage Temperature
TSTG
CURA
152
100
CURA
153
200
100 200
70 140
CURA
154
400
CURA
155
600
400 600
280 420
50
1.0
50
1.5
1.3
5.0
100
20
-55 to +150
-55 to +150
CURA
156
800
CURA
157
1000
800 1000
560 700
1.7
75
Unit
V
V
V
A
A
V
nS
uA
C/W
C
C
Note 1: Thermal resistance from junction to lead, 8.0x8.0mm square (0.13 mm thick) land areas.
MDS0210013B
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