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PDF 2SJ204 Data sheet ( Hoja de datos )
| Número de pieza | 2SJ204 | |
| Descripción | P-CHANNEL MOS FET FOR SWITCHING | |
| Fabricantes | NEC | |
| Logotipo |  |
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MOS FIELD EFFECT TRANSISTOR
2SJ204
P-CHANNEL MOS FET
FOR SWITCHING
PACKAGE DIMENSIONS (Unit: mm)
2.8±0.2
N
ó
+l
en
N .,
-o
Oó
+l
~
ó
The 2SJ204, P-channel vertical type MOS FET, is a switching device
which can be driven directly by the output of JCs having a 5 V power
source.
As the MOS FET has low on-state resistance and excellent switching
characteristics, it is suitable for driving actuators such as motors, relays,
and solenoids.
FEATURES
• Directly driven by ICs having a 5 V power supply.
• Has low on-state resistance
nRos(onl = 13 MAX. @VGs = -4.0 V, lo= -10 mA
Ros(onl = 8 n MAX. @VGs = -10 V, lo= -10 mA
• Complementary to 2SK1582
.S Drain(D)
1 . Source
2. Gata
3 , Orein
MARK: H15
Gate(G)
o--.-_J
Source(S)
(Diode in the figure ls the parasitle dlode .)
OUALITY GRADE
Standard
Please refer to "Ouality grade on NEC Semiconductor Devices"
(Document number IEI-1209) published by NEC Corporation to know
the specification of quality grade on the devices and its recommended
applications.
ABSOLUTE MAXIMUM RATINGS (Ta= 25 °C)
PARAMETER
Drain to Source Voltage
Gate to Source Voltaga
Drain Current
Drain Current
Total Power Dissipation
Channel Temperatura
Operating Temperatu re
Storaga Temperatura
SYMBOL
Voss
VGss
lo( DCl
lo(pulse)
PT
Tch
Topt
Tstg
RATINGS
-30
'1'20
'1'200
'1'400
200
150
-55 to +80
-55 to +150
UNIT
V
V
mA
mA
mW
•c
•c
•c
VGs=O
Vos= o
TEST CONDITIONS
PW ~ 1Oms, Duty Cycle ~ 50%
Document No. TC-2326
(O.D.No. TC- 7967A)
Date Published April 1991 M
Printed in Japan
© NEC Corporation 1991
this material copyrighted by its respective manufacturer
1 page  
www2.tSvsJa2t.c0o4m.pl
RECOMMENDED SOLDERING CONDITIONS
Mounting of this produet by soldering should be done under the following conditions.
Please eonsuit with our representatives about soldering methods and conditions other than these recommended.
SURFACE MOUNT TYPE
For details of the recommended soldering conditions, see the information document.
"Device Mounting Manual for Surface Mounting (IEI-616)."
Soldering Method
Soldering Conditions
lnfrared Reflow
Package peak temp.: 230 °C
Soldering time: within 30 sec (above 21 O°C)
Soldering times: 1, Days limitation: none*
Vapor Phase Soldering
Package peak temp.: 215 °C
Soldering time: within 40 sec (above 200 °C)
Soldering times: 1, Days limitation: none*
Wave Soldering
Soldering bath temp.: 260 °C
Soldering time: within 1Osec
Soldering times: 1, Days limitation: none*
* Stored days under storage conditions at 25 •c and below 65% R.H. after dry-pack opened.
Note 1: Combination of soldering methods should be avoided.
Symbol for
Recommended Conditions
IR30-00
VP15-00
WS60-00
this material copyrighted by its respective manufacturer
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet 2SJ204.PDF ] | |
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