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PDF AT97SC3201 Data sheet ( Hoja de datos )
| Número de pieza | AT97SC3201 | |
| Descripción | Trusted Platform Module | |
| Fabricantes | ATMEL Corporation | |
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Features
• Full TCG/TCPA V1.1b Compatibility
• Single Chip Turnkey Solution
• Hardware Asymmetric Crypto Engine
• 2048 RSA Sign in 500 ms Using CRT
• AVR 8-bit RISC Microprocessor
• Internal EEPROM Storage for 10+ RSA Keys
• 33 MHz LPC (Low Pin Count) Bus for Easy PC Interface
• 100 KHz System Management Bus (SMBus) Two-wire Interface
• Secure Hardware and Firmware Design and Chip Layout
• True Random Number Generator (RNG)
• Secure Real-time Clock Option
• 3.3V ±10% Supply Voltage
• 28-lead TSSOP Package or 40-lead MLF Package
• 0–70°C Temperature Range
Description
The AT97SC3201 is a fully integrated security module designed to be integrated into
personal computers and other embedded systems. It implements version 1.1b of the
Trusted Computing Platform Alliance (TCPA) specification for Trusted Platform
Modules (TPM). This specification has been adopted by the Trusted Computing Group
(TCG).
The TPM includes a crypto accelerator capable of computing a 2048-bit RSA
signature in 500 ms and a 1024-bit RSA signature in 100 ms, both using CRT.
Communication to and from the TPM can occur through one of two interface
protocols: either a 33-MHz LPC interface or a 100-KHz SMBus two-wire interface.
Figure 1. AT97SC3201 Block Diagram
ROM
Program
EEPROM
Program
Trusted
Platform
Module
AT97SC3201
Summary
33 MHz
LPC
Interface
SMBCLK/IOA
SMBDAT/IOB
IOC
VBB
32.768 kHz
SMBus Interface
or GPIO
RTC
Physical
Security
Circuitry
AVR
8/16 Bit
CPU
RNG
Timer
SRAM
EEPROM
Data
CRYPTO
Engine
The chip includes a full hardware random number generator that is used for the TCG
protocol and is also available to the system for any random numbers it may need
during normal operation.
Rev. 2015DS-TPM–7/04
Note: This is a summary document. A complete document is
available under NDA. For more information, please contact your
local Atmel sales office.
1
1 page  
Package Drawing
28A3 – TSSOP
b
E E1
AT97SC3201
L
L1
e
Top View
End View
A D A2
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
9.60
6.00
–
0.80
0.19
0.45
NOM
9.70
8.10 BSC
6.10
–
1.00
–
0.65 BSC
0.60
1.00 REF
MAX
9.80
6.20
1.20
1.05
0.30
0.75
NOTE
2, 5
3, 5
4
Notes:
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)
per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
1/8/02
2325 Orchard Parkway
R San Jose, CA 95131
TITLE
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO. REV.
28A3
A
2015DS-TPM–7/04
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet AT97SC3201.PDF ] | |
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