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Fairchild Semiconductor - Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs

Numéro de référence 74ALVC16500MTD
Description Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs
Fabricant Fairchild Semiconductor 
Logo Fairchild Semiconductor 





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74ALVC16500MTD fiche technique
October 2001
Revised October 2001
74ALVC16500
Low Voltage 18-Bit Universal Bus Transceivers
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16500 is an 18-bit universal bus transceiver
which combines D-type latches and D-type flip-flops to
allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the
device operates in the transparent mode when LEAB is
HIGH. When LEAB is LOW, the A data is latched if CLKAB
is held at a HIGH or LOW logic level. If LEAB is LOW, the A
bus data is stored in the latch/flip-flop on the HIGH-to-LOW
transition of CLKAB. When OEAB is HIGH, the outputs are
active. When OEAB is LOW, the outputs are in a high-
impedance state.
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, and CLKBA. The output enables are com-
plementary (OEAB is active HIGH and OEBA is active
LOW).
The ALVC16500 is designed for low voltage (1.65V to
3.6V) VCC applications with I/O capability up to 3.6V.
The 74ALVC16500 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s 1.65V–3.6V VCC supply operation
s 3.6V tolerant inputs and outputs
s tPD (A to B, B to A)
3.4 ns max for 3.0V to 3.6V VCC
4.0 ns max for 2.3V to 2.7V VCC
7.0 ns max for 1.65V to 1.95V VCC
s Power-off high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s Uses patented noise/EMI reduction circuitry
s Latchup conforms to JEDEC JED78
s ESD performance:
Human body model > 2000V
Machine model >200V
Note 1: To ensure the high-impedance state during power up or power
down, OEBA should be tied to VCC through a pull-up resistor and OEAB
should be tied to GND through a pull-down resistors; the minimum value of
the resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number Package Number
Package Description
74ALVC16500MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available on Tape and Reel. Specify by appending the suffix letter Xto the ordering code.
© 2001 Fairchild Semiconductor Corporation DS500684
www.fairchildsemi.com

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