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Fairchild Semiconductor - Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs

Numéro de référence 74ALVC16601MTD
Description Low Voltage 18-Bit Universal Bus Transceivers with 3.6V Tolerant Inputs and Outputs
Fabricant Fairchild Semiconductor 
Logo Fairchild Semiconductor 





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74ALVC16601MTD fiche technique
October 2001
Revised October 2001
74ALVC16601
Low Voltage 18-Bit Universal Bus Transceivers
with 3.6V Tolerant Inputs and Outputs
General Description
The ALVC16601 is an 18-bit universal bus transceiver
which combines D-type latches and D-type flip-flops to
allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs. The clock can be con-
trolled by the clock-enable (CLKENAB and CLKENBA)
inputs. For A-to-B data flow, the device operates in the
transparent mode when LEAB is HIGH. When LEAB is
LOW, the A data is latched if CLKAB is held at a HIGH-to-
LOW logic level. If LEAB is LOW, the A bus data is stored
in the latch/flip-flop on the LOW-to-HIGH transition of
CLKAB. When OEAB is LOW, the outputs are active. When
OEAB is HIGH, the outputs are in the high-impedance
state.
Data flow for B to A is similar to that of A to B but uses
OEBA, LEBA, CLKBA and CLKENBA.
The ALVC16601 is designed for low voltage (1.65V to
3.6V) VCC applications with I/O capability up to 3.6V.
The ALVC16601 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s 1.65V–3.6V VCC supply operation
s 3.6V tolerant inputs and outputs
s tPD (A to B, B to A)
3.4 ns max for 3.0V to 3.6V VCC
4.0 ns max for 2.3V to 2.7V VCC
7.0 ns max for 1.65V 1.95V VCC
s Power-down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s Uses patented noise/EMI reduction circuitry
s Latchup conforms to JEDEC JED78
s ESD performance:
Human body model > 2000V
Machine model >200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Note 1: To ensure the high-impedance state during power up or power
down, OE should be tied to VCC through a pull-up resistor; the minimum
value of the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Order Number Package Number
Package Description
74ALVC16601GX
(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
(Preliminary) [TAPE and REEL]
74ALVC16601MTD
(Note 3)
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Note 2: BGA package available in Tape and Reel only.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.
© 2001 Fairchild Semiconductor Corporation DS500682
www.fairchildsemi.com

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