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PDF AT87C5103 Data sheet ( Hoja de datos )
| Número de pieza | AT87C5103 | |
| Descripción | C51 LPC 8-Bit Microcontroller | |
| Fabricantes | ATMEL Corporation | |
| Logotipo |  |
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AT83C5103 - AT87C5103 PPAP
AT83C5103 / AT87C5103
C51 LPC 8-Bit Microcontroller
ATMEL P/N : AT8xC5103xxx-IBRAL
PPAP Submission
Date:
Supplier:
Address:
March 2003
ATMEL-NANTES SA
La Chantrerie
BP 70602
44306 NANTES Cedex 3
France
Tel : 33(0) 2 40 18 18 18
Fax : 33(0) 2 40 18 19 20
Rev. 1 : Initial Submission – 2003 March
1
1 page  
PPAP Checklist
Requirements
Table of contents
PPAP Checklist
1. Design Records
2. Engineering Change Documents
3. Engineering Approval
4. Design FMEA
5. Process Flow Diagrams
6. Process FMEA
7. Dimensional Results
8. Records of Material / Performance Test Results
8.1 Material Test Records
8.2 Performance Test Records
9. Initial Process Study
10. Measurement System Analysis Study
11. Qualified Laboratory Documentation
12. Control Plan
13. Part Submission Warrant (PSW)
14. Appearance Approval Report
15. Bulk Material Requirements Checklist
16. Sample Production Parts
17. Master Sample
18. Checking Aids
19. Customer Specific Requirements
AT83C5103 - AT87C5103 PPAP
Included
yes
yes
yes
yes
yes
Project Risk analysis
yes
yes
Not Applicable
Not applicable to IC
yes
yes
yes
yes
yes
yes
Not applicable to IC
Not applicable to IC
Separate order
Not attached
Not Applicable
Not defined
Rev. 1 : Initial Submission – 2003 March
5
5 Page 
AT83C5103 - AT87C5103 PPAP
2.3 Qualification and Change Procedure
2.3.1 Qualification methodology
All product qualifications are split into three distinct steps as shown below. Before a product is released for use,
successful qualification testing are required at wafer, device and package level.
- Wafer Level Reliability consists in testing individually basic process modules regarding their well known
potential limitations (Electromigration, Hot Carriers Injection, Oxide Breakdown, NVM Data Retention). Each
test is performed using wafer process specific structures.
- Device reliability is covering either dice design and processing aspects. The tests are performed on device
under qualification, but generic data may also be considered for reliability calculation.
- For each package type proposed in the Datasheet, it is verified that qualification data are available. If not
qualification tests are carried out for the new package types. In addition, one package type is selected to
verify packaging reliability of the device under qualification.
Product
Qualification
Wafer Level
Reliability
Device
(Design / Process)
Reliability
Packaging
Reliability
Rev. 1 : Initial Submission – 2003 March
11
11 Page | ||
| Páginas | Total 27 Páginas | |
| PDF Descargar | [ Datasheet AT87C5103.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AT87C5103 | C51 LPC 8-Bit Microcontroller | ATMEL Corporation |
| AT87C5103 | C51 LPC 8-Bit Microcontroller | ATMEL Corporation |
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