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PDF BTA204S-800E Data sheet ( Hoja de datos )
| Número de pieza | BTA204S-800E | |
| Descripción | 3Q Hi-Com Triac | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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BTA204S-800E
3Q Hi-Com Triac
12 August 2014
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT428 (DPAK)
surface-mountable plastic package. This "series E" triac balances the requirements of
commutation performance and gate sensitivity and is intended for interfacing with low
power drivers and logic ICs including microcontrollers.
2. Features and benefits
• 3Q technology for improved noise immunity
• Direct triggering from low power drivers and logic ICs
• High blocking voltage capability
• High commutation capability with sensitive gate
• Planar passivated for voltage ruggedness and reliability
• Sensitive gate for easy logic level triggering
• Surface-mountable package
• Triggering in three quadrants only
3. Applications
• AC solenoids
• General purpose motor control
• Home appliances
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
VDRM
repetitive peak off-
state voltage
ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
tp = 20 ms; Fig. 4; Fig. 5
IT(RMS)
RMS on-state current full sine wave; Tmb ≤ 107 °C; Fig. 1;
Fig. 2; Fig. 3
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
Min Typ Max Unit
- - 800 V
- - 25 A
- - 4A
- - 10 mA
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NXP Semiconductors
30
ITSM
(A)
20
BTA204S-800E
3Q Hi-Com Triac
003aag086
10 IT ITSM
t
0
1
f = 50 Hz
10
1/f
Tj(init) = 25 °C max
102 103
number of cycles
Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA204S-800E
Product data sheet
All information provided in this document is subject to legal disclaimers.
12 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
5 / 14
5 Page 
NXP Semiconductors
11. Soldering
Footprint information for reflow soldering of DPAK (SOT428) package
BTA204S-800E
3Q Hi-Com Triac
SOT428
1
4.6
5.75 5.65
3.6
2.45
6
1.15
2.4 2.3
7
6.15
5.9
5.8
1.8
4.725
6.5
6
6.125
0.3
1.5 1.3
1.4
1.65
4.57
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-03-12
14-03-17
Fig. 13. Reflow soldering footprint for DPAK (SOT428)
BTA204S-800E
Product data sheet
All information provided in this document is subject to legal disclaimers.
12 August 2014
sot428_fr
© NXP Semiconductors N.V. 2014. All rights reserved
11 / 14
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| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet BTA204S-800E.PDF ] | |
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