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PDF BTA208S-600D Data sheet ( Hoja de datos )
| Número de pieza | BTA208S-600D | |
| Descripción | 3Q Hi-Com Triac | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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BTA208S-600D
3Q Hi-Com Triac
11 August 2014
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT428 (DPAK)
surface mountable plastic package. This "series D" triac balances the requirements of
commutation performance and gate sensitivity and is intended for interfacing with low
power drivers and logic ICs including microcontrollers.
2. Features and benefits
• 3Q technology for improved noise immunity
• Direct gate triggering from low power drivers and logic ICs
• High commutation capability
• High voltage capability
• Planar passivated for voltage ruggedness and reliability
• Surface mountable package
• Triggering in three quadrants only
• Very sensitve gate for easy logic level triggering
3. Applications
• Electronic thermostats
• General purpose motor controls
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
VDRM
repetitive peak off-
state voltage
ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
tp = 20 ms; Fig. 4; Fig. 5
IT(RMS)
RMS on-state current full sine wave; Tmb ≤ 102 °C; Fig. 1;
Fig. 2; Fig. 3
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 7
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; Fig. 7
Min Typ Max Unit
- - 600 V
- - 65 A
- - 8A
- - 5 mA
- - 5 mA
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1 page  
NXP Semiconductors
103
ITSM
(A)
102
(1)
BTA208S-600D
3Q Hi-Com Triac
003aab121
IT ITSM
t
tp
Tj(init) = 25 °C max
10
10- 2
tp ≤ 20 ms
(1) dIT/dt limit
10- 1
1
10
tp (ms)
Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values
102
BTA208S-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
5 / 14
5 Page 
NXP Semiconductors
11. Soldering
Footprint information for reflow soldering of DPAK (SOT428) package
BTA208S-600D
3Q Hi-Com Triac
SOT428
1
4.6
5.75 5.65
3.6
2.45
6
1.15
2.4 2.3
7
6.15
5.9
5.8
1.8
4.725
6.5
6
6.125
0.3
1.5 1.3
1.4
1.65
4.57
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-03-12
14-03-17
Fig. 14. Reflow soldering footprint for DPAK (SOT428)
BTA208S-600D
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 August 2014
sot428_fr
© NXP Semiconductors N.V. 2014. All rights reserved
11 / 14
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