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ON Semiconductor - Dual Type D Flip-Flop

Numéro de référence MC14013B
Description Dual Type D Flip-Flop
Fabricant ON Semiconductor 
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MC14013B fiche technique
MC14013B
Dual Type D Flip-Flop
The MC14013B dual type D flip−flop is constructed with MOS
P−channel and N−channel enhancement mode devices in a single
monolithic structure. Each flip−flop has independent Data, (D), Direct
Set, (S), Direct Reset, (R), and Clock (C) inputs and complementary
outputs (Q and Q). These devices may be used as shift register
elements or as type T flip−flops for counter and toggle applications.
Features
Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Logic Edge−Clocked Flip−Flop Design
Logic State is Retained Indefinitely with Clock Level either High or
Low; Information is Transferred to the Output only on the
Positive−going Edge of the Clock Pulse
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Pin−for−Pin Replacement for CD4013B
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free and are RoHS Compliant
http://onsemi.com
SOIC−14
D SUFFIX
CASE 751A
SOEIAJ−14
F SUFFIX
CASE 965
TSSOP−14
DT SUFFIX
CASE 948G
PIN ASSIGNMENT
QA 1
QA 2
CA 3
RA 4
DA 5
SA 6
VSS 7
14 VDD
13 QB
12 QB
11 CB
10 RB
9 DB
8 SB
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
Parameter
Value
Unit
VDD
Vin, Vout
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
−0.5 to +18.0
−0.5 to VDD + 0.5
V
V
Iin, Iout Input or Output Current
(DC or Transient) per Pin
±10 mA
PD Power Dissipation, per Package
(Note 1)
500 mW
TA Ambient Temperature Range
−55 to +125
°C
Tstg Storage Temperature Range
−65 to +150
°C
TL Lead Temperature
(8−Second Soldering)
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Temperature Derating: “D/DW” Packages: –7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS (Vin or Vout) VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
MARKING DIAGRAMS
14
14013BG
AWLYWW
1
SOIC−14
14
MC14013B
ALYWG
1
SOEIAJ−14
14
14
013B
ALYW G
G
1
TSSOP−14
A
WL, L
YY, Y
WW, W
G or G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
July, 2014 − Rev. 10
1
Publication Order Number:
MC14013B/D

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