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PDF OBTS949 Data sheet ( Hoja de datos )
| Número de pieza | OBTS949 | |
| Descripción | Smart Lowside Power Switch | |
| Fabricantes | Siemens Semiconductor Group | |
| Logotipo |  |
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HITFET®BTS 949
Smart Lowside Power Switch
Features
Product Summary
• Logic Level Input
Drain source voltage
• Input Protection (ESD)
On-state resistance
• Thermal Shutdown
Current limit
• Overload protection
Nominal load current
• Short circuit protection
Clamping energy
• Overvoltage protection
• Current limitation
• Maximum current adjustable with external resistor
• Current sense
• Status feedback with external input resistor
• Analog driving possible
VDS
RDS(on)
ID(lim)
ID(ISO)
EAS
60 V
18 mΩ
9.5 A
19 A
6000 mJ
Application
• All kinds of resistive, inductive and capacitive loads in switching or
linear applications
• µC compatible power switch for 12 V and 24 V DC applications
• Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET in Smart SIPMOS® chip on chip tech-
nology. Fully protected by embedded protected functions.
1
IN
2
NC
dv/dt
limitation
Current
limitation
Overvoltage
protection
Vbb
+
LOAD
Drain
3
M
4 CC
RCC
ESD
Overload
protection
Over-
temperature
protection
SShhoorrtt cciirrccuuiitt
pprrootteeccttiioonn
Source
HITFET®
5
Semiconductor Group
Page 1
14.07.1998
1 page  
Block Diagramm
Terms
IIN
1 IN
RCC
V IN VCC
4 CC
HITFET
RL
3
D
ID
5
S
VDS Vbb
The ground lead impedance of RCC
should be as low as possible
Input circuit (ESD protection)
IN
ESD-ZDI
Source
ESD zener diodes are not designed
for DC current > 2 mA @ VIN>10V.
BTS 949
Inductive and overvoltage output clamp
VZ D
S
HITFET
Short circuit behaviour
V IN
I D(SCp)
ID ID(Lim)
t 0 tm t 1
t2
t0: Turn on into a short circuit
tm : Measurementpoint for ID(lim)
t1: Activation of the fast temperature sensor and
regulation of the drain current to a level wher
the junction temperature remains constant.
t2: Thermal shutdown caused by the second
temperature sensor, achieved by an
integrating measurement.
Semiconductor Group
Page 5
14.07.1998
5 Page 
BTS 949
Edition 7.97
Published by Siemens AG,
Bereich Halbleiter Vetrieb,
Werbung, Balanstraße 73,
81541 München
© Siemens AG 1997
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components,
not for applications, processes and circuits implemented within components or assemblies.
The information describes a type of component and shall not be considered as warranted characteristics.
Terms of delivery and rights to change design reserved.
For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany
or the Siemens Companies and Representatives worldwide (see address list).
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Siemens Office, Semiconductor Group.
Siemens AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales
office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components 1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or
systems2 with the express written approval of the Semiconductor Group of Siemens AG.
1)A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of
that device or system.
2)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain and/or protecf human life. If they fail, it is reasonable to assume that the health of the
user or other persons may be endangered.
Semiconductor Group
Page 11
14.07.1998
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet OBTS949.PDF ] | |
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