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PDF SPI-240-15-T1 Data sheet ( Hoja de datos )
| Número de pieza | SPI-240-15-T1 | |
| Descripción | Ultraminiature photointerrupter supporting reflow soldering (Darlington-transistor type) | |
| Fabricantes | Sanyo Semicon Device | |
| Logotipo |  |
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Ordering number : EN6027
SPI-240-15-T1
GaAs Infrared LED
SPI-240-15-T1
Ultraminiature photointerrupter supporting reflow soldering
(Darlington-transistor type)
Features
• GaAs Infrared LED plus Darlington Phototransistor
• Photo-Interrupter for reflow soldering
• Compact type : H4.95 ! L6.0 ! W5.5mm
• Taping type
Absolute Maximum Ratings at Ta=25°C, 65%RH
Input LED
Output
Phototransistor
Parameter
Forward Current
Reverse Voltage
Power Dissipation
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector Curren
Power Dissipation
Operating Temperature
Storage Temperature
Symbol
IF
VR
PD
VCEO
VECO
IC
PC
Topr
Tstg
Rating
50
5
70
20
5
20
70
--20 to +80
--30 to +85
Unit
mA
V
mW
V
V
mA
mW
°C
°C
Electro-Optical Characteristics at Ta=25°C, 65%RH
Input
Output
Coupled
Parameter
Forward Voltage
Reverse Current
Dark Current
Collector Output Current
Collector Emitter
Saturation Voltage
Symbol
VF
IR
ICEO
IC
VCE(sat)
Rise Time
tr
Fall Time
tf
*1 Measurement Circuit of Collector Current
Condition
IF=10mA
VR=5V
IF=0mA, VCE=10V
IF=4mA,VCE=2V*1
IF=4mA, IC=250µA
VCC=5V, RL=100Ω
IC=10mA
Min. Typ. Max. Unit
1.0 1.15 1.4
V
-- -- 10 µA
-- -- 1 µA
0.5 3
-- mA
-- -- 1.2 V
-- 100 --
-- 100 --
µs
µs
IF=4mA
VCE=2V
Ic A
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
72199 GI, (MI) No.6027 1/7
1 page  
SPI-240-15-T1
Package dimensions and Pin connection
As stated in the sttached paper. (No.6027 4/7)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only one time.
Temperature : On the topsurface of product
Reflow type : Hot air
Max 220°C
180°C
Max 160°C
(2) Manusl soldering
Temperature
Time
Clearance
Max 60sec
: Max. 290°C (Soldering iron tip temperature)
: Max. 3 sec
: Min. 0.5mm from package
0.5mm
Max 5sec
Max 40sec
0.5mm
PRECAUTIONS
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend under the stay.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the recommended mounting dimension.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature : 5 to 30°C
Humidity
: Max 70%RH
Term
: Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions : +60±5°C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
No.6027 5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet SPI-240-15-T1.PDF ] | |
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