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Toshiba - PAL / NTSC / SECAM 1 Chip IC

Numéro de référence TB1254N
Description PAL / NTSC / SECAM 1 Chip IC
Fabricant Toshiba 
Logo Toshiba 





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TB1254N fiche technique

TENTATIVE TOSHIBA Bi-CMOS INTEGRATED CIRCUIT, SILICON MONOLITHIC
TB1254N
PAL / NTSC / SECAM 1CHIP (IF+VCD PROCESSOR) IC

The TB1254N is a TV signal processor IC, which contains
PIF, SIF, Video, Chroma and deflection signal processors
for worldwide Multi-color systems. Also, it has AV switch
for TV/EXT inputs.
The line-up and flexibility of this TB1251 series contributes
to reduce development costs and components in a TV
sets.
SDIP56-P-600
Weight: 5.55g (typ)
FEATURES
IF STAGE
 Multi-system IF
 SIF 4.5 ~ 6.5 MHz
 One External BPF for Multi-SIF carrier
 Inter carrier inputs
 VCO tank coil alignment free
 for L system,
Positive demodulation
V low Ch
VIDEO STAGE
 Built-in Y delay line (8 adjustable steps)
 Built in C trap filter (Switchable)
TEXT STAGE
 Built-in AKB
AKB on/off
AKB Color temperature control
 Analog RGB interfaces
 ABL / ACL
DEFLECTION STAGE
 Built-in H-VCO
 ramp distortion correction
 Stand Along Sync in port
 Sand Castle Pulse Output
(HD+VD+Gate Pulse)
CHROMA STAGE
 Multi-color Demoduration
 Automatic Chroma Identification
 1 Xtal for Multi-color Systems
(3.58MHz/4.43MHz/M-PAL/N-PAL)
 Built-in1H Delay line
 Cb/Cr input ports
 Built-in BPF / TOF
 Fsc Output
 Two NTSC demodulation phase
AV SWITCH
 Visual TV / EXT inputs
 Audio TV / EXT inputs
 TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless,
semiconductor devices in general can malfunction or jail due to their inherent electrical sensitivity and
vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to
observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could
cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that
TOSHIBA products are used within specified operating range as set forth in the most recent products specifications.
Also, please keep in mind the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability
Handbook.
 The products described in this document are subject to foreign exchange and foreign trade control laws.
 The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of
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