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PDF MC74AC08 Data sheet ( Hoja de datos )
| Número de pieza | MC74AC08 | |
| Descripción | Quad 2-Input AND Gate | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MC74AC08 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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MQuCa7d4A2C−I0ene8pt,u4UMt .ACcoN7m4DAGCaTt0e8• Outputs Source/Sink 24 mA
h• ′ACT08 Has TTL Compatible Inputs
taS• Pb−Free Packages are Available
.DaMAXIMUM RATINGS
w Rating
Symbol Value Unit
wwDC Supply Voltage (Referenced to GND)
VCC
−0.5 to
+7.0
V
mDC Input Voltage (Referenced to GND)
Vin
−0.5 to
V
VCC +0.5
oDC Output Voltage (Referenced to GND)
Vout
−0.5 to
V
.cVCC +0.5
DC Input Current, per Pin
Iin ±20 mA
UDC Output Sink/Source Current, per Pin
Iout
±50 mA
DC VCC or GND Current per Output Pin
ICC
±50 mA
t4Storage Temperature
Tstg
−65 to
°C
+150
eMaximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
enormal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
hreliability may be affected.
SVCC
ta14 13 12 11 10
9
8
.Da1 2 3 4 5 6 7
w GND
Figure 1. Pinout: 14−Lead Packages Conductors
ww .com(Top View)
http://onsemi.com
14
1
14
1
PDIP−14
N SUFFIX
CASE 646
SO−14
D SUFFIX
CASE 751A
14
1
TSSOP−14
DT SUFFIX
CASE 948G
14
1
SOEIAJ−14
M SUFFIX
CASE 965
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
heet4U*For additional information on our Pb−Free strategy and soldering details, please
Sdownload the ON Semiconductor Soldering and Mounting Techniques
taReference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
www.Da© Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
March, 2005 − Rev. 7
MC74AC08/D
1 page  
PDIP−14
MC74AC08N
AWLYYWW
MC74AC08, MC74ACT08
MARKING DIAGRAMS
SOIC−14
TSSOP−14
AC08
AWLYWW
AC
08
ALYW
SOEIAJ−14
74AC08
ALYW
MC74ACT08N
AWLYYWW
ACT08
AWLYWW
ACT
08
ALYW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
74ACT08
ALYW
ORDERING INFORMATION
Device
Package
Shipping†
MC74AC08N
PDIP−14
500 Units / Rail
MC74AC08D
SOIC−14
55 Units / Rail
MC74AC08DR2
SOIC−14
2500 / Tape & Reel
MC74AC08DTR2
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
MC74AC08MEL
SOEIAJ−14
(Pb−Free)
2000 / Tape & Reel
MC74ACT08N
PDIP−14
500 Units / Rail
MC74ACT08D
SOIC−14
55 Units / Rail
MC74ACT08DR2
SOIC−14
2500 / Tape & Reel
MC74ACT08DTR2
TSSOP−14
(Pb−Free)
2500 / Tape & Reel
MC74ACT08NG
PDIP−14
(Pb−Free)
500 Units / Rail
MC74ACT08MEL
SOEIAJ−14
(Pb−Free)
2000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MC74AC08.PDF ] | |
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