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PDF MC-156 Data sheet ( Hoja de datos )
| Número de pieza | MC-156 | |
| Descripción | THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT | |
| Fabricantes | Epson Company | |
| Logotipo |  |
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Crystal unit
THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT
MC-156
• High-density mounting-type SMD of 1.5mm thickness.
• Small packaging area and light weight.
• Excellent shock resistance and environmental capability.
• Most suitable for small communications devices.
Actual size
Specifications (characteristics)
Item
Symbol
Nominal frequency
f
Temperature Storage temperature
range
Operating temperature
Maximum drive level
TSTG
TOPR
GL
Soldering condition
TSOL
Frequency tolerance(standard)
Peak temperature(frequency)
Temperature coefficient(frequency)
Load capacitance
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
∆f/f
θT
a
CL
R1
C1
C0
IR
fa
Shock resistance
S.R.
Specifications
32.768kHz
75.000kHz
-55˚C to +125˚C
-40˚C to +85˚C
1.0µW max.
Twice at under 260˚C within 10 sec.
or under 230˚C within 3 min.
±20ppm, ±50ppm
25˚C ±5˚C
-0.04ppm/ ˚C2 max.
6pF to ∞
65 kΩ max.
30kΩ
1.9fF typ.
0.8pF typ.
500 MΩ min.
±3ppm/year max.
±5ppm max.
Metal may be exposed on the top of this product. This won't affect any quality, reliability or electrical spec.
Remarks
please contact us for inquiries
about usable frequencies
Operating drive level 0.5µW max.
Ta=25˚C, DL=0.1µW
Please specify
Ta=25˚C ±3˚C, first year
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
External dimensions
(Unit: mm)
Recommended soldering pattern (Unit: mm)
7.1 max.
#4 #3
EA89
#1 #2
Internal connection
#4 #3
#1 #2
1.2 3.88
1.2
0.4
5.08
Do not connect #2 and #3 to external device.
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| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet MC-156.PDF ] | |
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