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ON Semiconductor - Integrated Passive Filter

Numéro de référence NUF2441FC
Description Integrated Passive Filter
Fabricant ON Semiconductor 
Logo ON Semiconductor 





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NUF2441FC fiche technique
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NUF2441FC
Integrated Passive Filter
with ESD Protection
This device is designed for cell phone applications requiring
Headset and Speaker Phone, EMI Filtering and ESD Protection.
This device offers an integrated solution in a small package reducing
PCB space and cost.
Features:
Provides EMI Filtering and ESD Protection
Single IC Offers Cost Savings by Replacing 2 Inductors,
4 Capacitors, and 4 TVs Diodes
Compliance with IEC61000−4−2, (Level 4)
30 kV (Contact), 30 kV (air)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
This is a Pb−Free Device*
Benefits:
Flip−Chip Package Minimizes PCB Space
Integrated Circuit Increases System Reliability versus Discrete
Component Implementation
TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
Typical Applications:
Cell Phones
Communication Circuits
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Value
Unit
ESD Discharge IEC61000−4−2
Vpp
kV
Contact Discharge
30
Air Discharge
30
Operating Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg −55 to +150 °C
Lead Solder Temperature
(10 second duration)
TL 260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
CIRCUIT DESCRIPTION
B2
C1 L C2
B1 B3
A1 A3
C1 L C2
A2
A1
Flip−Chip
CASE 499J
MARKING
DIAGRAM
È
2441AYWW
2441
A
Y
WW
= Specific Device Code
= Assembly Location
= Year
= Work Week
PIN CONFIGURATION
A1 B1
A2 B2
A3 B3
(Bump View)
ORDERING INFORMATION
Package
NUF2441FCT1
Device
Shipping
Flip−Chip 3000/Tape & Reel
NUF2441FCT1G Flip−Chip 3000/Tape & Reel
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
May, 2005 − Rev. 4
1
Publication Order Number:
NUF2441FC/D

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