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74VCX16240 fiches techniques PDF

ON Semiconductor - Low-Voltage 1.8/2.5/3.3V 16-Bit Buffer

Numéro de référence 74VCX16240
Description Low-Voltage 1.8/2.5/3.3V 16-Bit Buffer
Fabricant ON Semiconductor 
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74VCX16240 fiche technique
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74VCX16240
Low−Voltage 1.8/2.5/3.3V
16−Bit Buffer
With 3.6 VTolerant Inputs and Outputs
(3State, Inverting)
The 74VCX16240 is an advanced performance, inverting 16bit
buffer. It is designed for very highspeed, very lowpower operation
in 1.8 V, 2.5 V or 3.3 V systems.
When operating at 2.5 V (or 1.8 V) the part is designed to tolerate
voltages it may encounter on either inputs or outputs when interfacing
to 3.3 V busses. It is guaranteed to be overvoltage tolerant to 3.6 V.
The 74VCX16240 is nibble controlled with each nibble functioning
identically, but independently. The control pins may be tied together to
obtain full 16bit operation. The 3state outputs are controlled by an
Output Enable (OEn) input for each nibble. When OEn is LOW, the
outputs are on. When OEn is HIGH, the outputs are in the high
impedance state.
Features
Designed for Low Voltage Operation: VCC = 1.65 V 3.6 V
3.6V Tolerant Inputs and Outputs
High Speed Operation: 2.5 ns max for 3.0 V to 3.6 V
3.0 ns max for 2.3 V to 2.7 V
6.0 ns max for 1.65 V to 1.95 V
Static Drive:
±24 mA Drive at 3.0 V
±18 mA Drive at 2.3 V
±6 mA Drive at 1.65 V
Supports Live Insertion and Withdrawal
IOFF Specification Guarantees High Impedance When VCC = 0 V
Near Zero Static Supply Current in All Three Logic States (20 mA)
Substantially Reduces System Power Requirements
Latchup Performance Exceeds ±250 mA @ 125°C
ESD Performance: Human Body Model >2000 V;
Machine Model >200 V
All Devices in Package TSSOP are Inherently PbFree*
http://onsemi.com
MARKING DIAGRAM
48
48
1
TSSOP48
DT SUFFIX
CASE 1201
A
WL
YY
WW
VCX16240
AWLYYWW
1
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
74VCX16240DT
TSSOP
(PbFree)
39 / Rail
74VCX16240DTR
TSSOP
(PbFree)
2500 / Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 Rev. 5
1
Publication Order Number:
74VCX16240/D

PagesPages 9
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