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PDF AT97SC3203S Data sheet ( Hoja de datos )
| Número de pieza | AT97SC3203S | |
| Descripción | Trusted Platform Module | |
| Fabricantes | ATMEL Corporation | |
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Features
• Full Trusted Computing Group (TCG) Trusted Platform Module (TPM) Version 1.2
Compatibility
• Single-chip Turnkey Solution
• Hardware Asymmetric Crypto Engine
• 2048-bit RSA Sign in 500 ms
• AVR® RISC Microprocessor
• Internal EEPROM Storage for RSA Keys
• 100 kHz System Management Bus (SMBus™) Two-wire Interface
• Secure Hardware and Firmware Design and Chip Layout
• True Random Number Generator (RNG) - FIPS 140-2 Compliant
• NV Storage Space for 1280 bytes of user defined data
• 3.3V ±10% Supply Voltage
• 28-lead TSSOP Package or 40-lead QFN Package
• 0–70°C Temperature Range
Description
The AT97SC3203S is a fully integrated security module designed to be integrated into
embedded systems. It implements version 1.2 of the Trusted Computing Group (TCG)
specification for Trusted Platform Modules (TPM).
The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA
signature in 500 ms and a 1024-bit RSA signature in 100 ms. Performance of the
SHA-1 accelerator is 50 µs per 64-byte block. In most cases, TCG key generation
operations will be completed using a proprietary mechanism in less than 1 msec.
Table 1. Pin Configurations
Pin Name Description
VCC
SB3V
3.3V (±10%) Supply Voltage
Standby 3.3V (± 10%) Supply Voltage
VBAT
GND
2.5–4.0V Battery Input
Ground
RESET#
Reset Input Active Low
SMBDAT
SMBus Data Input/Output
SMBCLK
SMBus Clock Input
AVRCLK
33-MHz AVR Clock Input
Xtall/32K in 32.768 kHz Crystal Input
XtalO
32.768 kHz Crystal Output
GPIO6
General Purpose Input/Output
TestI
Test Input (disabled)
TestBI
Test Input (disabled)
NC No Connect
NBO
Not Bonded Out
www.DataSheet4U.com
Trusted
Platform
Module
AT97SC3203S
SMBus
Two-Wire
Interface
Summary
5132AS–TPM–1/07
Note: This is a summary document. A complete document
is available through your local Atmel sales office.
1 page  
Package Drawing
28A3 – TSSOP
b
E E1
AT97SC3203S
L
L1
e
Top View
End View
A D A2
Side View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
9.60
6.00
–
0.80
0.19
0.45
NOM
9.70
8.10 BSC
6.10
–
1.00
–
0.65 BSC
0.60
1.00 REF
MAX
9.80
6.20
1.20
1.05
0.30
0.75
NOTE
2, 5
3, 5
4
Notes:
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in)
per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
1/8/02
2325 Orchard Parkway
R San Jose, CA 95131
TITLE
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO. REV.
28A3
A
5132AS–TPM–1/07
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet AT97SC3203S.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AT97SC3203 | Trusted Platform Module | ATMEL Corporation |
| AT97SC3203S | Trusted Platform Module | ATMEL Corporation |
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