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PDF SX16A-12SA Data sheet ( Hoja de datos )

Número de pieza SX16A-12SA
Descripción SIP Non-Isolated Power Module
Fabricantes Bourns Electronic 
Logotipo Bourns Electronic Logotipo



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Features
SIP (Single in-line package)
Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
16 A output current
Up to 94 % efficiency
Small size, low profile
Cost-efficient
Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Optional sequencing function
SX(T)16A-12SA SIP Non-Isolated Power Module
Description
Bourns® SX(T)16A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard
features such as remote on/off, precisely regulated programmable output voltage and overcurrent protection and optional output
voltage sequencing.
Specifications
Parameter
INPUT
Voltage
Current
Remote: ON/OFF
Low or Open =
High =
Standard
On
Off
-P option
Off
On
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(i/t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(i/t = 2.5 A/µs; 25 °C)
GENERAL
MTBF
Operating Temperature
Storage Temperature
Switching Frequency
Efficiency
(Vin = 12 Vdc, TA= 25 °C, Full Load)
Min. Nom. Max.
8.3 12 14
10.0
Units
Vdc
Adc
Notes
0.4 Vdc
2.4 Vin Vdc
10 µA max.
1 mA max.
0.75 5.5 Vdc
0.0 16.0 Adc
-2.0 2.0 % Vo, set
0.3 % Vo, set
0.4 % Vo, set
0.4 % Vo, set
0 to +85 °C
30 75 mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
12 30 mVrms 1 µF ceramic//10 µF tantalum capacitors
200 mV 1 µF ceramic//10 µF tantalum capacitors
25 µs
100
50
mV
µs
2 x 150 µF polymer capacitors
10,000
-40 +85
-55 +125
300
85.0
87.0
88.0
90.5
92.0
94.0
kHrs
°C
°C
kHz
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Applications
Intermediate Bus architecture
Distributed power applications
Workstations and servers
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.

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