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PDF ESDALC6V1-1BT2 Data sheet ( Hoja de datos )

Número de pieza ESDALC6V1-1BT2
Descripción Single line low capacitance Transil
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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ESDALC6V1-1BT2
Single line low capacitance Transil™ for ESD protection
Features
1 line low capacitance TRANSIL diode
Very thin package: 0.4 mm max.
Bidirectional ESD protection
Breakdown Voltage VBR = 6.1 V min.
Low diode capacitance (22 pF typ. at 0V)
Low leakage current: 100 nA max. @ 3V
Very small PCB area: 0.6 mm2
Leadfree package
Benefits
High ESD protection level
High integration
Suitable for high density boards
Complies with the following standards
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G - Method 3015-7: class 3B
– Human body model
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Computers
Printers
Communication systems
Cellular phone handsets and accessories
Video equipment
Thin SOD882
Figure 1. Functional diagram
I/O1
I/O2
Description
The ESDALC6V1-1BT2 is a bidirectional single
line TVS diode designed to protect the datalines
or other I/O ports against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
TM: Transil is a trademark of STMicroelectronics
September 2007
Rev 1
1/10
www.st.com

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ESDALC6V1-1BT2 pdf
ESDALC6V1-1BT2
3 Package information
Package information
Note:
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 3. Thin SOD882 dimensions
INDEX AREA
(D/2 x E/2)
D
E
A A1
INDEX AREA
(D/2 x E/2)
L1
b1
b2
L2
OPTIONAL
PIN # 1 ID
e
Dimensions
Ref. Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.30
0.40 0.012
0.016
A1 0.00
0.05 0.000
0.002
b1 0.20 0.25 0.30 0.008 0.010 0.012
b2 0.20 0.25 0.30 0.008 0.010 0.012
D 1.00
0.039
E 0.60
0.024
e 0.65
0.026
L1 0.45 0.50 0.55 0.018 0.020 0.022
L2 0.45 0.50 0.55 0.018 0.020 0.022
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
Figure 11. Footprint (dimensions in mm) Figure 12. Marking
0.55
0.55
0.40
0.50
LPin1
Pin 2
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