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PDF NS4L107T Data sheet ( Hoja de datos )

Número de pieza NS4L107T
Descripción WARM WHITE LED
Fabricantes NICHIA CORPORATION 
Logotipo NICHIA CORPORATION Logotipo



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No Preview Available ! NS4L107T Hoja de datos, Descripción, Manual

Nichia STS-DA1-0204
<Cat.No.080513>
www.DataSheet4U.com
SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE LED
MODEL : NS4L107T
NICHIA CORPORATION

1 page




NS4L107T pdf
Nichia STS-DA1-0204
<Cat.No.080513>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Standard
Test Item
Test Method
Test Conditions
Note
Resistance to
JEITA ED-4701 Tsld=260°C, 10sec.
2 times
Soldering Heat
300 301
(Pre treatment 30°C,70%,168hrs.)
(Reflow Soldering)
Solderability
JEITA ED-4701 Tsld=215 ± 5°C, 3sec.
1 time
(Reflow Soldering)
300 303
(Lead Solder)
over 95%
Thermal Shock
JEITA ED-4701 0°C ~ 100°C
20 cycles
www.DataSheTeet4mUp.ceormature Cycle
300 307
15sec. 15sec.
JEITA ED-4701 -40°C ~ 25°C ~ 100°C ~ 25°C
100 cycles
100 105
30min. 5min. 30min. 5min.
Moisture Resistance Cyclic JEITA ED-4701 25°C ~ 65°C ~ -10°C
10 cycles
200 203
90%RH 24hrs./1cycle
High Temperature Storage JEITA ED-4701 Ta=100°C
1000 hrs.
200 201
Temperature Humidity
JEITA ED-4701 Ta=60°C, RH=90%
1000 hrs.
Storage
100 103
Low Temperature Storage JEITA ED-4701 Ta=-40°C
1000 hrs.
200 202
Steady State Operating Life
Ta=25°C, IF=60mA
1000 hrs.
Tested with Nichia standard circuit board.
Steady State Operating Life
Ta=85°C, IF=40mA
1000 hrs.
of High Temperature
Tested with Nichia standard circuit board.
Steady State Operating Life
60°C, RH=90%, IF=60mA
500 hrs.
of High Humidity Heat
Tested with Nichia standard circuit board.
Steady State Operating Life
Ta=-40°C, IF=50mA
1000 hrs.
of Low Temperature
Tested with Nichia standard circuit board.
Permanence of Marking
JEITA ED-4701 Solvent : Isopropyl Alcohol
1 time
500 501
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
Vibration
JEITA ED-4701 100 ~ 2000 ~ 100Hz Sweep 4min.
400 403
200m/s2
48min.
3directions, 4cycles
Electrostatic Discharges
JEITA ED-4701 R=1.5k, C=100pF
3 times
300 304
Test Voltage=2kV
Negative/Positive
Thermal resistance of LED with Nichia standard circuit board : Rja 70°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
Number of
Damaged
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
Luminous Flux
VF IF=50mA
- Initial Level
φv
IF=50mA
Initial Level 0.7
-
The test is performed after the board is cooled down to the room temperature.
1.1
-4-

5 Page





NS4L107T arduino
Nichia STS-DA1-0204
<Cat.No.080513>
(6) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip or hand soldering method.
· Recommended soldering conditions
Reflow Soldering
Lead Solder
Lead-free Solder
Pre-heat
120 ~ 150°C
180 ~ 200°C
Pre-heat time 120 sec. Max.
120 sec. Max.
Peak 240°C Max.
260°C Max.
temperature
www.DataSheetS4oUl.dceorming time
Condition
10 sec. Max.
refer to
Temperature - profile 1.
10 sec. Max.
refer to
Temperature - profile 2.
(N2 reflow is recommended.)
Although the recommended soldering conditions are specified in the above table, reflow
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
2.5 ~ 5°C / sec.
2.5 ~ 5°C / sec.
240°C Max.
Pre-heating
10sec. Max.
120 ~ 150°C 60sec.Max.
Above 200°C
1 ~ 5°C / sec.
1 ~ 5°C / sec.
260°C Max.
Pre-heating
10sec. Max.
180 ~ 200°C 60sec.Max.
Above 220°C
120sec.Max.
[Recommended soldering pad design]
4.0
2.8
120sec.Max.
Use the following conditions shown in the figure.
(Unit : mm)
1.8 4-R0.3
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow. It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs
will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Die Heat sink is to be soldered.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-10-

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